Analog Devices,inc.

Siu Lung Ng

Xiaojie Xue

Jicheng Yang

Jia Gao

Shafi Saiyed

A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

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Stoneham, MA, United States of America

Siu Lung Ng