Lumentum Operations LLC

Applied Radar, Inc.

Jds Uniphase Corporation

Siu Kwan Cheung

Lijun Zhu

Karl M Kissa

Wei Shi

Hao Huang

William H Weedon, Iii

Raman Srinivasan

Huanlin Zhu

John Michael Miller

Gregory J McBrien

Matthew Glenn Peters

Glen Drake

Lucas Morales

Sean Burns

David Glassner

Mohammad Ali Shirazi Hosseini Dokht

Yuanzhen Zhuang

Tao Li

Kevin Wang

Tian Shi

Willam H Weedon, Iii

Timothy Philip Halloran

Grant T Kiehne

Srinath Chakravarthy

David M Shemo

Ed L Wooten

In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.

Optical assembly with a microlens component and contacts on a same surface of a vertical cavity surface emitting laser device

An optical chip may include a vertical-cavity surface-emitting laser (VCSEL) structure. The optical chip may include a capacitor over at least a portion of an active layer of the VCSEL structure that is outside of an active region of the VCSEL structure. The capacitor may include a first metal layer over the portion of the active layer, a dielectric layer on the first metal layer, and a second metal layer on the dielectric layer. The optical chip may include an isolation region between a substrate of the VCSEL and a portion of the capacitor outside of the VCSEL.

Vertical-cavity surface-emitting laser array with integrated capacitor

An optical device may include a substrate including a conductive core, a first layer stack on a first surface of the conductive core, a conductor-filled trench extending through the first layer stack to the conductive core such that the conductor-filled trench is on the first surface of the conductive core, and a second layer stack on a second surface of the conductive core. The optical device may include a vertical-cavity surface-emitting laser (VCSEL) chip above the conductor-filled trench. The VCSEL chip may include an array of VCSELs. A size of the conductor-filled trench may match a size of the VCSEL chip, match a size of an emission region of the array of VCSELs, or be greater than the size of the emission region of the array of VCSELs and less than the size of the VCSEL chip.

Optical device including a substrate with a conductor-filled trench on a conductive core

A substrate may include a thermally conductive metal core having a top side and a bottom side, a first dielectric coating on the top side of the metal core, a second dielectric coating on the bottom side of the metal core, a first metal circuit layer formed above the first dielectric coating, and a second metal circuit layer formed under the second dielectric coating. In some implementations, the first dielectric coating and the second dielectric coating have thicknesses below sixty micrometers and respective thermal resistances under fifteen degrees Celsius per watt. In some implementations, one or more electrical currents flowing vertically across a dielectric coating have a low parasitic inductance based on the thickness of the dielectric coating, and the metal core may dissipate heat flowing across the dielectric coating and into the metal core.

Packaging substrate with low thermal resistance and low parasitic inductance

A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or more contact features protruding from the surface of the wafer carrier. The cathode plate may be configured to provide an electrical connection between the wafer carrier and the probe card, wherein a portion of a surface of the cathode plate is configured to be disposed on the one or more contact features of the wafer carrier. The probe card may be configured to test, using one or more probes associated with the probe card, the wafer when the wafer is on the surface of the wafer carrier.

Wafer prober to facilitate testing of a wafer using nanosecond pulses

A radio frequency (RF) interconnect for an optical modulator may comprise a circuit board to route a set of RF signals from a corresponding set of RF feeds to a substrate interface on a surface of a substrate of the optical modulator. The circuit board may be positioned along the surface of the substrate of the optical modulator. The circuit board may include a set of traces. A trace, of the set of traces, may be connected to a corresponding RF feed, of the set of RF feeds, at a height different than a height of the surface of the substrate of the optical modulator. The trace may be connected to the substrate interface.

High bandwidth RF or microwave interconnects for optical modulators

An optical modulator may include at least one ground electrode. The optical modulator may include at least one signal electrode parallel to the at least one ground electrode. The optical modulator may include at least one waveguide parallel to the at least one ground electrode and the at least one signal electrode. The optical modulator may include a first substrate disposed underneath the at least one ground electrode and the at least one signal electrode relative to a surface of the optical modulator. The optical modulator may include a second substrate disposed underneath at least a portion of the first substrate relative to the surface of the optical modulator. The optical modulator may include a floating conductor disposed between the first substrate and the second substrate.

Optical modulator

A circulator capable of simultaneous transmit and receive operations, high frequency, high isolation and noise figure suppression comprising: an antenna port; a transmission port; a receiving port; three quadrature hybrids, two directional couplers; wherein transmit signal entering the transmit port are split into quadrature components and coupled separately and directionally by the two directional couplers to the antenna port where the coupled quadrature components of the transmit signal are recombined in phase, while the transmit leakage to the receive port are recombined destructively in phase; said arrangement simultaneously allows the receive signal entering the antenna port to be split into quadrature components by the antenna quadrature hybrid and transmitted through the directional couplers separately and entering the receive quadrature hybrid where the quadrature components of the receive signal are recombined in phase at the receive port; said arrangement reduces the insertion loss from the antenna port to the receive port.

Quadrature-directed quasi circulator

A three port circulator capable of simultaneous transmit and receive operations, high frequency, enhanced high isolation, noise suppression at the receive port and broadband performance comprising: an antenna port; a transmission port; a receiving port; wherein each port is connected to a 90 degree combiner/divider or a quadrature hybrid for splitting an input signal into two output components, the said output components have a ninety degrees relative phase difference to each other; each of said 90 degree combiners/dividers or quadrature hybrids in addition to the connection to the above mentioned ports has at least two output connections each of which are connected to a ferrite circulator and if a fourth connection, said fourth connection is attached to a matching load circuit; this arrangement of circuits allows the phase shifted signals from the transmit port to enter the 90 degree combiner/divider or quadrature hybrid and be recombined in phase at the antenna port, any residue signal due to impedance mismatch at the antenna port and/or the isolation or imperfect suppression of mode degeneracy of the ferrite circulator at the Y-junction will get to the 90 degree combiner/divider or quadrature hybrid at the receive port and is phased cancelled; said arrangement simultaneously allows the receive signal entering the antenna port and proceeding to the 90 degree combiner/divider or quadrature hybrid at the antenna port and to be combined in phase by the 90 degree combiner/divider or quadrature hybrid at the receive port.

Lange-ferrite circulator for simultaneous transmit and receive (STAR) with high isolation and noise suppression

A circulator capable of simultaneous transmit and receive operations, high frequency, and high isolation and broadband performance comprising: an antenna port; a transmission port; a receiving port; wherein each port is connected to a 90 degree combiner/divider for splitting an input signal into two output components, the said output components have a ninety degrees relative phase difference to each other; each of said 90 degree combiner/dividers in addition to the connection to the above mentioned ports has at least two output connections each of which are connected to a Y-junction and if a fourth connection, said fourth connection is attached to a matching load circuit; this arrangement of circuits allows the portion of the phase shifted signals from the transmit port to enter the antenna 90 degree combiner/divider and be enhanced at the antenna port, while the rest of the signal enters the receive 90 degree combiner/divider and are phased cancelled; said arrangement allows the signals from the antenna port 90 degree combiner/divider to combine in phase at the receive port.

Quasi active MIMIC circulator

A reduced size RF signal and ground electrode interface is configured to provide better field confinement of dominant coplanar waveguide mode in the propagation direction and reduce coupling RF energy into a substrate beneath the launch, while matching the impedance of the launch to both that of the coplanar microwave electrode structure overlying the interaction region, and that of the external RF connection to the launch. In ground plane embodiments, an underlying ground plane provides better modal confinement of the dominant coplanar waveguide mode and precludes coupling of RF power to the substrate under the launch. In other embodiments, finite width electrodes provide better modal transition and mitigate against coupling to substrate modes, while providing a pad geometry that facilitates connections to external transmission line components.

Launch interface electrode structure for suppressing coupling to substrate modes for electro-optic modulator

A co-planar waveguide interferometric electro-optic modulator is disclosed. A Z-cut lithium niobate electro-optic substrate includes a first and second waveguide that are formed in the lithium niobate electro-optic substrate. An elongate RF electrode at least partially covers one of the waveguides. A slotted electrode is disclosed formed by two elongate substantially-parallel electrodes one of which is at least partially covers the other of the waveguides. At least one electrode is substantially greater, preferably at least twice the width of the elongate RF electrode.

Growing community of inventors

Storrs, CT, United States of America

Siu Kwan Cheung