Sensonor As

Sissel Jacobsen

Gjermund Kittilsland

Daniel Lapadatu

Trond Westgaard

Gjermund Kittisland

A micro-electromechanical system (MEMS) structure for an angular rate sensor includes seismic masses arranged to have a first degree of rotational freedom about an axis that is substantially perpendicular to the plane of a silicon substrate, and a second degree of rotational freedom about an axis substantially coincident with the longitudinal axis of driving beams to which the seismic masses are attached. A sensing system is arranged such that, when the structure is subjected to an angular velocity around a third axis that is substantially in the plane of the silicon substrate and perpendicular to the longitudinal axis of the beams, a Coriolis force arises which causes the secondary oscillation of the seismic masses.

MEMS structure for an angular rate sensor

A method for providing hermetic sealing within a silicon-insulator composite wafer for manufacturing a hermetically sealed structure, comprising the steps of: patterning a first silicon wafer to have one or more recesses that extend at least partially through the first silicon wafer; filling said recesses with an insulator material able to be anodically bonded to silicon to form a first composite wafer having a plurality of silicon-insulator interfaces and a first contacting surface consisting of insulator material; and using an anodic bonding technique on the first contacting surface and an opposing second contacting surface to create hermetic sealing between the silicon-insulator interfaces, wherein the second contacting surface consists of silicon.

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Horten, Norway

Sissel Jacobsen