Mitsubishi Plastics, Inc.

Singetsu Yamada

Kouichirou Taniguchi

A film of a resin composition comprising total 100 parts by weight of a crystalline polyarylketone resin (A) and a noncrystalline polyetherimide resin (B), and 5 to 50 parts by weight of a filler, said film satisfies the following relation()&#x3c;()&#x2266;()+20wherein, Tc (A) is a peak temperature of crystallization of the crystalline polyarylketone resin (A),Tc (A+B) is the peak temperature of crystallization of the film, and Tg (B) is a glass transition temperature of the noncrystalline polyetherimide resin (B), each temperature value being measured bu differential scanning calorimetry at a heating rate of 10 degrees C./minute. The film and a metal laminate thereof are suitable for electronics parts.

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Nagahama, Japan

Singetsu Yamada