Au Optronics Corporation

Sin-Jie Wang

Chung-Hung Chen

Shyh-Bin Kuo

Yi-Cheng Lai

Hsiang-Chi Cheng

Shih-Hsing Hung

Kuo-Hsiang Chen

Yu-Chih Wang

An integrated circuit, a wireless communication card and a wiring structure of an identification mark are provided. The integrated circuit includes a power supply wiring, a ground wiring and at least one identification mark pattern. Each identification mark pattern has a first conductive wiring and a second conductive wiring that overlap each other, wherein the first conductive wiring is electrically connected to the power wiring, and the second conductive wiring is electrically connected to the ground wiring.

Integrated circuit, wireless communication card and wiring structure of identification mark

A chip is provided. The chip includes a flexible substrate, a plurality of thin-film transistors, a redistribution layer, a first power rail layer, and a second power rail layer. The plurality of thin-film transistors are disposed on the flexible substrate. The redistribution layer is disposed above the plurality of thin-film transistors. The first power rail layer is disposed above the redistribution layer. The first power rail layer provides a first voltage to the plurality of thin-film transistors. The second power rail layer is disposed above the first power rail layer. The second power rail layer provides a second voltage to the plurality of thin-film transistors, wherein the second power rail layer is disposed in a grid shape.

Chip having a flexible substrate

Growing community of inventors

Hsinchu, Taiwan

Sin-Jie Wang