Industrial Technology Research Institute

Sin-Jhu Wun

Shang-Chun Chen

Wei-Yen Chen

A test device configured to test a photonic integrated circuit (IC) is provided. The photonic IC includes at least one waveguide edge coupler, and the test device includes an optical coupler. The optical coupler is configured to be optically aligned with the photonic IC, and includes at least one focusing lens and a first reflector. The at least one focusing lens is aligned with the at least one waveguide edge coupler. A light from the waveguide edge coupler is focused by the focusing lens, reflected by the first reflector, and transmitted to a fiber connector in sequence, or a light from the fiber connector is reflected by the first reflector and focused onto the waveguide edge coupler by the focusing lens in sequence. A heterogeneously integrated structure is also provided.

Test device and heterogeneously integrated structure

A silicon photonic package structure including a substrate, a conductive bump, an obstacle structure, a laser diode, a mode converter, and a ball lens is provided. The conductive bump is disposed on the substrate. The obstacle structure is formed on the substrate. The laser diode is disposed above the substrate and electrically bonded to the conductive bump. A surface of the laser diode facing the substrate has a ridge. An end of the ridge has a light-emitting surface. The obstacle structure is located between the conductive bump and the ridge. A thickness of the obstacle structure in a direction perpendicular to the surface of the substrate is greater than a thickness of the ridge in the direction perpendicular to the surface of the substrate. The mode converter is formed on the substrate. The ball lens is formed on the substrate and located between the light-emitting surface and a light input end of the mode converter.

Growing community of inventors

Hsinchu, Taiwan

Sin-Jhu Wun