Applied Materials, Inc.

Simon Yavelberg

Yongqi Hu

Jeonghoon Oh

Christopher Richard Mahon

Periya Gopalan

Rajkumar Alagarsamy

Steven M Zuniga

Andrew J Nagengast

Govinda Raj

Samuel Chu-Chiang Hsu

Gautam Shashank Dandavate

Steven Mark Reedy

Hung Chih Chen

Kadthala Ramaya Narendrnath

Zubin Huang

Ramesh Gopalan

Gangadhar Sheelavant

Dmitry Lubomirsky

Ramprakash Sankarakrishnan

Bopanna Ichettira Vasantha

Noel Manto

Jerry C Chen

Kartik Ramaswamy

Srinivas D Nemani

Jennifer Y Sun

Hou Tee Ng

Daniel John Hoffman

Nag B Patibandla

Anantha K Subramani

Harald Herchen

Thomas B Brezoczky

Qiwei Liang

Hui W Chen

Rashid Mavliev

Lakshmanan Karuppiah

Swaminathan T Srinivasan

Donald J Olgado

David Palagashvili

Kasiraman Krishnan

Mats Larsson

Christopher A Rowland

David J Lischka

Rolf A Guenther

Alpay Yilmaz

Brian K Hatcher

Jim Kellogg Atkinson

Dan Zhang

Gerald John Alonzo

Xueyu Qian

Robert E Ryan

Patrick Leahey

Jonathan Paul Domin

Timothy D Driscoll

Daniel Martin

Toshikazu Tomita

Victor H Fuentes

Richard E Remington

Edward L Floyd

Stephen A Wells

William L Manofsky, Jr

Patrick Ala

Bo B Ding

Allen I D'ambra

Some implementations of a retaining ring has an inner surface having a first portion formed of multiple planar facets and a second portion that adjoins the first portion along a boundary and includes a frustoconical surface that is sloped downwardly from outside in. Some implementations of the retaining ring have a crenellated or serpentine inner surface, and/or an inner surface with alternating region of different surface properties or different tilt angles.

Retaining ring having inner surfaces with features

A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.

Polishing pad with secondary window seal

An additive manufacturing system includes a platen to support an object to be fabricated, a dispenser assembly positioned above the platen, and an energy source configured to selectively fuse a layer of powder. The dispenser assembly includes a first dispenser, a second dispenser, and a drive system. The first dispenser delivers a first powder in a first linear region that extends along a first axis, and the second dispenser delivers a second powder in a second linear region that extends parallel to the first linear region and is offset from the first linear region along a second axis perpendicular to the first axis. The drive system a drive system moves the support with the first dispenser and second dispenser together along the second axis.

Multiple sequential linear powder dispensers for additive manufacturing

An edge ring and process for fabricating an edge ring are disclosed herein. In one embodiment, an edge ring includes an annular body and a plurality of thermal breaks disposed within the annular body. The thermal breaks are disposed perpendicular to a center line of the annular body of the edge ring.

Edge ring for a substrate processing chamber

A retaining ring for a chemical mechanical polishing carrier head having a mounting surface for a substrate is provided herein. In some embodiments, the retaining ring may include an annular body have a central opening, a channel formed in the body, wherein a first end of the channel is proximate the central opening, and a sensor disposed within the channel and proximate the first end, wherein the sensor is configured to detect acoustic and/or vibration emissions from processes performed on the substrate.

Chemical mechanical polishing retaining ring with integrated sensor

The implementations described herein generally relate to a sensing device for use in the semiconducting industry, which sense process parameters to control semiconductor processes. More specifically, the implementations relate to packaging for a surface acoustic wave (SAW) based devices or wireless or RF-responsive sensors for use in the harsh processing environments of a semiconductor processing chamber such that the neither the sensor and its components nor the chamber components interfere with or contaminate one another. The sensor packaging may include various packaging layers with or without protective coatings and a waveguide. The packaging may have a thickness chosen such that the thickness is less than the electromagnetic wavelength of a SAW sensor radio wave. The sensing devices may be disposed in cavities of the chamber, the processing volume, on chamber components, and/or on the substrate.

Surface acoustic wave sensors in semiconductor processing equipment

Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, and a sensor assembly. The retaining ring is coupled to the body. The sensor assembly is positioned at least partially in the body. The sensor assembly includes a transmitter, an antenna, and a vibrational sensor. The transmitter has a first end and a second end. The antenna is coupled to the first end of the transmitter. The vibrational sensor is coupled to the second end. The vibrational sensor is configured to detect vibration during chemical mechanical processes with respect to radial, azimuthal, and angular axes of the carrier head.

Chemical mechanical polishing smart ring

A retaining ring and a chemical mechanical planarization system (CMP) are disclosed. In one embodiment, a retaining ring for a polishing system includes a ring-shaped body having a polished inner diameter. The body has a bottom surface having grooves formed therein, an outer diameter wall, and an inner diameter wall, wherein the inner diameter wall is polished to a roughness average (R) of less than about 30 microinches (&#x3bc;in).

Retaining ring for lower wafer defects

Magnetron configurations that provide more efficient and/or more uniform cooling characteristics and methods for forming the magnetrons are provided. The magnetron includes one or more flow directing structures disposed between parallel cooling fins. The flow directing structures direct air flow across various surfaces of the cooling fins that otherwise would be obstructed by magnetron components, reducing the incidence and/or magnitude of hot spots on the cooling fins and/or on other magnetron components. The flow directing structures also adjust flow rates to improve cooling efficiency.

Magnetron having enhanced cooling characteristics

Growing community of inventors

Cupertino, CA, United States of America

Simon Yavelberg