Osram Gmbh

Osram Opto Semiconductors Gmbh

Osram Gesellschaft MIT Beschraenkter Haftung

Osram Oled Gmbh

Osram Gesellschaft MIT Beschrankter Haftung

Osram Ag

Ledvance Gmbh

Osram S.p.a. - Societa' Riunite Osram Edison Clerici

Simon Schwalenberg

Peter Brick

Julius Muschaweck

Hubert Halbritter

Thomas Schwarz

Stefan Groetsch

Michael Wittmann

Ralph Bertram

Harald Stoyan

Siegfried Herrmann

Georg Bogner

Stefan Illek

Erwin Lang

Karl Engl

Karsten Diekmann

Marc Philippens

Andreas Dobner

Ulrich Streppel

Petrus Sundgren

Andreas Biebersdorf

Jan Marfeld

Christoph Klemp

Sebastian Wittmann

Robert Kraus

Uli Hiller

Ines Pietzonka

Peter Sachsenweger

Laura Kreiner

Nicole Breidenassel

Michael Brandl

Guenter Hoetzl

Fabian Reingruber

Tobias Frost

Simone Capeleto

Christopher Wiesmann

Christine Rafael

Andreas Leber

Jean-Jacques Drolet

Felix Feix

Julia Stolz

Stefan Lorenz

Martin Reiss

Katrin Schroll

Klaus Burkard

Ana Kanevce

Christian Berger

Xue Wang

Matthias Loster

Nicole Heitzer

Eva-Maria Rummel

Marie Assmann

Hubertus Breier

Benjamin Jobst

Steffen Strauβ

Michael Weis

Andreas Rausch

The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.

μ-LED, μ-LED device, display and method for the same

An optoelectronic device, in particular a display device, comprises: at least one optoelectronic light source, an at least partially transparent front layer, an at least partially transparent support layer, wherein the light source is arranged between the front layer and the support layer, wherein a front side of the light source faces the front layer and a rear side of the light source faces the support layer, and wherein a limiting device is provided in a circumferential direction around the light source, wherein the limiting device limits a spatial region, in which the light source emits light such that total internal reflection of the emitted light, in particular at an interface between the front layer and the outside, is avoided or at least reduced.

Optoelectronic device

A sensor may include a light source, a light detector, and a housing. The housing may have a first upper side and extend from the first upper side, a first cavity and a second cavity. The light detector is arranged in the first cavity. The light source is arranged in the second cavity. A strut may be arranged between the first cavity and the second cavity and is made from a material that absorbs or reflects light. A first cover may be mounted above the first cavity and comprises a deflection region and a plane of incidence. The deflection region is designed such that 80% of the light which is incident in the deflection region on the plane of incidence of the first cover from a predetermined direction and which is incident on the light detector, is directed away from the light detector based on an optical element.

Sensor and biosensor

An optoelectronic component may include an optoelectronic semiconductor chip having an upper side and a lower side. An emitting region may be formed on the upper side. The emitting region may be configured to emit electromagnetic radiation. A subsurface, forming the emitting region, of the upper side may be smaller than a total surface of the upper side. A collimating optical element may be arranged over the emitting region.

Optoelectronic component

An illumination device is provided with an optoelectronic light source and an optical body. The optical body is divided into an inner lens part and an outer reflector part adjoining thereon outward in relation to directions perpendicular to a main direction, which body parts are formed monolithically with one another. The inner part is formed as a Fresnel lens with active flanks which acts as a collimating lens, so that a first part of the light which passes through the Fresnel lens via the active flanks is refracted toward the main direction. A second part of the light which passes through the Fresnel lens via folding flanks is refracted away from the main direction. A reflection surface is provided on the outer reflector part, on which the second part of the light is incident and is reflected thereon and deflected with the reflection toward the main direction.

Illumination device

A lens and a flash are disclosed. In an embodiment a lens includes a light entrance side having a plurality of Fresnel elements, a light exit side having a plurality of exit lenses having a second focal length and an optical axis, wherein the Fresnel elements and the exit lenses are optically associated with one another in a one-to-one manner, wherein each Fresnel element has an entrance surface which is convex in shape and which forms an entrance lens having a first focal length, wherein each Fresnel element has a deflection surface arranged directly downstream of the entrance surface, wherein the deflection surface is configured to deflect the light which entered the lens through the entrance surface by total internal reflection towards an associated exit lens, and wherein, with a tolerance, each entrance surface and the associated exit lens are located in the interrelated focal points.

Lens and flash

The invention relates to a lighting device () which is equipped with a plurality of semiconductor light sources () of different colors, downstream of which a common diffusor () is arranged, wherein the lighting device () has at least one light sensor () optically coupled to the diffusor ().

Lighting device having semiconductor light sources and a common diffusor

Various embodiments may relate to a method for producing an LED module, including providing a housing implemented as a hollow body, having an opening on a light exit side of the LED module, wherein the housing has a base side, arranged opposite to the light exit side, arranging a circuit board having one LED on the base side of the housing, pouring in one first base layer made of a curable material in a non-cured state through the opening into the housing, and pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing. The scattering layer is poured in onto the first base layer. The first base layer is not cured during the pouring in of the scattering layer, and after the pouring in of the scattering layer, the one first base layer and the scattering layer are cured.

Method for producing an LED module and LED module

In at least one embodiment of the luminaire (), it includes at least one optoelectronic semiconductor device () and at least one primary optical unit () which is disposed downstream of the semiconductor device () and is spaced apart therefrom. Furthermore, the luminaire () comprises a secondary optical unit () and/or a tertiary optical unit () which is/are disposed downstream of the primary optical unit (). A proportion of at least 30% of radiation emitted by the semiconductor device () passes to the secondary optical unit () and/or to the tertiary optical unit (). Furthermore, the secondary optical unit () and/or the tertiary optical unit () is/are arranged for small-angle scattering of the radiation emitted by the semiconductor device ().

Luminaire and traffic route illumination device

A lighting module, comprising a printed circuit board, which on the front side thereof, is populated by at least one light source as well as at least one light sensor; a hollow optical waveguide element, which laterally surrounds the at least one light source circumferentially; and a cover at least for the light sensor, arranged on the printed circuit board externally to the optical waveguide element, it being possible for a window to be located in the optical waveguide element to which window is connected a hollow light channel formed in and/or on the cover which leads to the light sensor.

Lighting module

An optical component comprises a carrier plate () having a first main surface () and a second main surface () facing away from the first main surface (), and a first lens structure () on the first main surface (), wherein the first lens structure () has at least a first lens element () having a first polygonal form and a second lens element () having a second polygonal form, the first lens structure () completely covers the first main surface (), and the first lens element () and the second lens element () are non-congruent with respect to one another and/or differ in terms of their orientation on the first main surface () of the carrier plate ().

Optical component and illumination device

An optical system including at least one light source, such as a LED source (), and an optics () subjected to aging as a result of exposure to the light source () is designed by: defining an aging model for the optics (), defining a thermal model for the light source () as a spatial function representative of the temperature generated by the light source (), and defining the distance of the optics () from the light source () as a function of the aging model and the thermal model. The optical overall system (single or multiple reflector and lens) is finally optimised starting from the results achieved in the previous steps.

Method of designing optical systems and corresponding optical system

A luminous module for a luminous chain may include at least one light source; and at least one electrical connection configured to supply the at least one light source, wherein the luminous module includes a heat sink.

Illumination module

An illumination device may include a hollow body having at least one light emission opening, wherein the hollow body has at least partly a reflective surface at its inner side, and at least one semiconductor luminous element, wherein a predominant portion of the light emitted by the semiconductor luminous element is incident on the inner side of the hollow body and is reflected from there through the light emission opening. The device may furthermore include a covering for the light emission opening with a grid-type arrangement of light transmission openings, wherein the at least one semiconductor luminous element is fixed to the covering and is directed at the inner side of the hollow body, and wherein a side area of the covering that surrounds the light transmission openings is at least partly reflectively coated.

Connecting element for mounting on a printed circuit board, which connecting element has at least two connecting lines which cross one another and are not electrically connected between respectively associated contacts.

LED luminous module with crossover connecting element

Growing community of inventors

Donaustauf, Germany

Simon Schwalenberg