Schott Ag

Simon Schmitt

Frank-Thomas Lentes

Andreas Ortner

Fabian Wagner

Albrecht Seidl

Michael G Kunz

Norihiko Inoue

Uwe Wortmann

Jonathan Mason

Norbert Kaspers

Jörn Gerban

Johannes Egger

Jens Ulrich Thomas

Volker Plapper

Patrick Bartholome

Antal Makacs

Devices and methods for processing a workpiece along a predetermined processing line are provided. The device includes: a pulsed, polychromatic laser beam generator; an optical arrangement; and a moving device. The laser beam generator generates a laser beam along a beam direction. The optical arrangement generates a focal line along the beam direction. The optical arrangement has a chromatic aberration for wavelength-dependent focusing of the laser beam and a filter for wavelength-dependent filtering of the laser beam. The moving device generates relative movement between the laser beam and the workpiece along the predetermined processing line.

Device and method for processing a workpiece along a predetermined processing line using a pulsed polychromatic laser beam and a filter

A method for separating a portion from a sheet glass element having a thickness of at least 2 millimeters along an intended separation line that divides the sheet glass element into the portion and a remaining main part is provided. The method includes producing filamentary damages comprising sub-micrometer hollow channels in a volume of the glass sheet element adjacently aligned along the separation line; and heating and/or cooling the glass sheet element to cause expansion and/or contraction so that the portion detaches from the main part along the separation line. The portion and the remaining main part each remain intact as a whole. The step of producing the filamentary damages includes generating a plasma within the volume with laser pulses of an ultrashort pulse laser; and displacing points of incidence of the laser pulses over a surface of the glass sheet element along the separation line.

Method and device for laser-assisted separation of a portion from a sheet glass element

A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (&#x3c3;) for separating the substrate along the separation line is smaller than a first reference stress (&#x3c3;) of the substrate and such that an edge strength &#x3c3;of the separation edge obtained after separation is greater than a second reference stress (&#x3c3;) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

Method for separating substrates

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Wiesbaden, Germany

Simon Schmitt