Osram Oled Gmbh

Pictiva Displays International Limited

Osram Opto Semiconductors Gmbh

Covestro Deutschland Ag

Osram Oledgmbh

Simon Schicktanz

Philipp Schwamb

Erwin Lang

Benjamin Krummacher

Benjamin Claus Hoeflinger

Joerg Farrnbacher

Karsten Diekmann

Daniel Steffen Setz

Evelyn Trummer-Sailer

Tobias Pohl-Zander

Egbert Hoefling

Dieter Musa

Egbert Höfling

Stefan Hartinger

Heinz Pudleiner

Nina Riegel

Klaus Meyer

Arne Fleissner

Kilian Regau

Michael Popp

Richard Baisl

Johannes Rosenberger

Thorsten Vehoff

Heiko Heppner

The invention relates to an optoelectronic module, comprising a housing () having a first housing part () having a first cover surface () and an opening (); a mechanically flexibly designed organic light source () having an illuminating surface (); and a cover element () which is mounted on the illuminating surface () and has a light-transmissive surface () facing away from the illuminating surface (), wherein the organic light source () is introduced at least at some points into the opening (), the first cover surface () is curved and/or bowed, the size of the illuminating surface () is at least 1 cm, preferably at least 5 cm, and the distance between the illuminating surface () and the first cover surface () is at most 1 cm, preferably at most 5 mm.

Optoelectronic module having an OLED and method for producing an optoelectronic module

The present invention relates to an organic radiation-emitting component with an active organic layer constituted to generate radiation and one or two radiation-output sides, characterised in that, on at least one radiation-output side of the component, a UV protective film is arranged and connected to the component, wherein the UV protective film contains at least one first layer (A) and a second layer (B), wherein the first layer (A) contains 0.01 to 20% by weight, with reference to the total weight of the first layer (A), of a UV absorber, and wherein the second layer (B) contains polycarbonate. Furthermore, the invention relates to the use of a component according to the invention as an organic light-emitting diode, and for lighting, especially for general lighting.

UV-protected component for OLEDs

In various aspects, an organic optoelectronic component and method for producing an organic optoelectronic component are described. An organic optoelectronic component may include a first electrode, an organic functional layer structure above the first electrode, a second electrode above the organic functional layer structure, an adhesive layer structure, and a protective film. The adhesive layer structure may contain a first adhesive layer above the first adhesive layer, and a second adhesive layer above the first adhesive layer. The first adhesive layer may be cured. The second adhesive layer may be adherent and elastic. The protective film may be above the second adhesive layer. The protective film may contain at least one region that is at least partly separated in a lateral direction.

Organic optoelectronic component and method for producing an organic optoelectronic component

According to the disclosure, a method for producing an organic component is provided. The method includes providing a carrier substrate; forming an electrically conductive layer on or above the carrier substrate; applying an electrical potential to the electrically conductive layer; and forming at least one organic, functional layer for forming the organic component on or above the electrically conductive layer at least partly during the process of applying the electrical potential to the electrically conductive layer.

Method for producing an organic component

The invention relates to an optoelectronic module, comprising a housing () having a first housing part () having a first cover surface () and an opening (); a mechanically flexibly designed organic light source () having an illuminating surface (); and a cover element () which is mounted on the illuminating surface () and has a light-transmissive surface () facing away from the illuminating surface (), wherein the organic light source () is introduced at least at some points into the opening (), the first cover surface () is curved and/or bowed, the size of the illuminating surface () is at least 1 cm2, preferably at least 5 cm2, and the distance between the illuminating surface () and the first cover surface () is at most 1 cm, preferably at most 5 mm.

According to the present disclosure, an organic optoelectronic component provides with a first electrode, an organic functional layer structure above the first electrode, a second electrode above the organic functional layer structure, at least one contact section for electrically contacting the organic optoelectronic component, and an electrically conductive elastomer connector which is arranged above the contact section and is electrically connected to the contact section. The contact section is electrically connected to one of the electrodes.

A method for producing an organic electronic device is disclosed. In an embodiment the method includes applying an organic material to a substrate to form at least one organic functional layer, applying a patterned electrode material to the at least one organic functional layer by a first mask, and removing the organic material from regions which are free of the electrode material.

Method for producing an organic electronic device

An organic optoelectronic component is disclosed. In an embodiment, an organic optoelectronic component includes an organic layer sequence having an active layer for emitting or absorbing electromagnetic radiation, a thin-film encapsulation on the organic layer sequence, an absorption layer on the organic layer sequence, the absorption layer configured to absorb and store a substance which is harmful to the organic layer sequence and a transport layer directly adjacent to the absorption layer, the transport layer configured to transport the harmful substance, wherein the transport layer has a greater diffusion coefficient and/or a higher transmission rate for the harmful substance than the absorption layer, and wherein the absorption layer has a higher storage capacity for the harmful substance than the transport layer so that the harmful substance, upon contact with the transport layer, is distributed within the transport layer and is subsequently absorbed by the absorption layer.

Organic optoelectronic component

The invention relates to an organic light-emitting component which has an organic functional layer stack () having at least one light-emitting layer, which is designed to generate light during operation of the component, a transparent first electrode () and a transparent second electrode (), which are designed to inject charge carriers into the organic functional layer stack () during operation, and a heat distribution layer (), which is applied over the electrodes () and the organic functional layer stack () and which has at least one plastic layer () and a highly heat conductive layer (), wherein the heat distribution layer () has at least one transparent sub-region () and at least one non-transparent sub-region ().

Organic light-emitting device

A double-sided emissive organic display device includes a carrier, a control element layer structure above the carrier, a plurality of first organic light emitting components, which are formed above the carrier, which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit first light substantially in a direction toward the carrier, and a plurality of second organic light emitting components, which are formed above the control element layer structure and which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit second light substantially in a direction away from the carrier.

Double-sided emissive organic display device and method for producing a double-sided emissive organic display device

An electronic component includes a connection carrier having a cover surface, a first electric connection point and a second electric connection point, and an organic active area. A first electrode interconnects in an electrically conductive manner the active area and the first electric connection point. An encapsulation layer protects the active area against humidity and atmospheric gases. The electronic component can be contacted from the outside by the electric connection points and the encapsulation layer is in direct contact, in places, with the connection carrier.

Electronic device

The invention relates to an optoelectronic component () comprising an organic light emitting diode () designed for emitting radiation and/or heat, a substrate (), on which the organic light emitting diode is arranged, wherein the substrate () comprises a first substrate material () and at least one substrate cavity () which is filled with a second substrate material () different than the first substrate material (), wherein the second substrate material () is designed to dissipate the heat emitted by the organic light emitting diode ().

Optoelectronic component and method of producing an optoelectronic component

Various embodiments relate to a method for closely connecting an organic optoelectronic component to a connection piece, including forming a first cavity in the organic optoelectronic component, wherein the first cavity has at least a first opening, introducing a connecting structure through the first opening into the first cavity, wherein the connecting structure has a first fixing area, wherein the first fixing area is configured partially complementarily to the form of the first cavity, forming a second cavity in a connection piece, wherein the second cavity has at least a second opening, wherein the second cavity is configured partially complementarily to the form of the second fixing area, and introducing a second fixing area through the second opening into the second cavity, and forming a friction-fitting connection of the organic optoelectronic component with the connecting piece once the connecting structure has been introduced into the first and the second cavity.

Method for closely connecting an organic optoelectronic component to a connection piece, connection structure for force-locking connecting, and optoelectronic component device

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Wuppertal, Germany

Simon Schicktanz