Other

University of Arkansas

Simon S Ang

Zhong Yu Chen

Keith C Burgers

Errol V Porter

Junji Ke

Kraig J Olejniczak

A rectangular power module with a body having two short ends defining a length and two long sides defining a width having three parallel circuit paths crossing the short width distance from side to side using side positioned gate terminals and planar top positioned top power terminal positioned between MOSFETS in the circuit for even thermal positioning and reduced current path, inductance, and resistance and increased power density.

High electric-thermal performance and high-power density power module

The design and fabrication of a highly integrated, intelligent integral horsepower, three-phase induction motor drive is based on multichip module (MCM) technology. A conventional three-phase induction motor is transformed into a stand-alone variable-speed drive by way of MCM technology. This solid-state controller-known as a multichip power module (MCPM)-uses known good die (KGD) to obtain minimal footprint, volume, and mass, while maximizing efficiency, reliability, and manufacturability. This is done by integrating the low-power control and high-power sections onto a single substrate. In accordance with one embodiment of the present invention, an integrated circuit assembly formed on a single substrate is capable of transforming and controlling AC power input to DC power output responsive to input signals. In accordance with another embodiment, an integrated circuit assembly on a single substrate is capable of receiving direct current power and controlling it and transforming it to alternating current power in single phase or multiphase form having variable magnitude and/or variable frequency. In accordance with a further embodiment, an integrated circuit assembly on a single substrate is capable of receiving alternating current power and controlling it and transforming it to alternating current power in single phase or multiphase form having variable magnitude and/or variable frequency.

Conversion of electrical energy from one form to another, and its management through multichip module structures

Growing community of inventors

Fayetteville, AR, United States of America

Simon S Ang