Apple Inc.

Research in Motion Corporation

Vbt Innovations Inc

Simon Regis Louis Lancaster-Larocque

Adam T Garelli

Dinesh C Mathew

William Francis Leggett

Mikael M Silvanto

Bruce E Berg

Collin D Chan

Jacob Seth Kononiuk

Bartley K Andre

Bryan W Posner

Houtan R Farahani

Robert Y Cao

Kevin M Robinson

Robert J Lockwood

Kevin M Keeler

Yi-Chen Kuo

Nicholas Alan Rundle

Shravan Bharadwaj

Ming Kun Shi

Christopher Bruni

Bradley Joseph Hamel

Michelle Rae Goldberg

Laura M DeForest

Ari P Miller

Matthew Allen Rendall

Sarah J Montplaisir

David S Herman

Vincent Yan

Brian K Miehm

Sunita Venkatesh

Steven J Osborne

Christopher R Fagan

Alix V McCabe

Kenneth A Ross

Lucas Allen Whipple

Andrew Jan Zwart

Dawit Mergia Effa

Greg Mark Derige

Kenneth King Ho Lee

Jake Zwart

Andrew Michael Cameron

Yongping Zhu

Bradley J Nielson

Ian S Theilacker

Ryan M Satcher

Cable assemblies for providing electrical communication between hinged sections of an electronic device are described. The cable assemblies can include a cover that covers one or more cables that run through a hinge region of the electronic device. The cable and cover can be drawn over a mandrel of the hinge region. The cover and the portions of the mandrel can be visible to a user at the hinge region of the electronic device. The cover can be sufficiently rigid to guide a path of the cable and protect the cable from bending beyond a prescribed angle during rotation of the electronic device at the hinge region. The cover can also be sufficiently rigid to prevent ceasing or folding of the cover and the cable during rotation of the electronic device at the hinge region.

Mandrel flex circuit routing

Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.

Method for smoothing substrate surface

Solid-state deposition of materials and structures formed thereof are described. In particular embodiments, solid-state deposition of materials may be utilized for integrated magnetic assemblies. The integrated magnetic assemblies may include a substrate having a cavity that is physically isolated from an environment external from the substrate and a magnetizable magnetic element formed of particles of magnetizable material. The magnetizable magnetic element may be carried within the cavity such that the magnetizable magnetic element fills the cavity and takes on a size and a shape of the cavity.

Solid state deposition of magnetizable materials

A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structured such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

Adaptive processes for improving integrity of surfaces

Cable assemblies for providing electrical communication between hinged sections of an electronic device are described. The cable assemblies can include a cover that covers one or more cables that run through a hinge region of the electronic device. The cable and cover can be drawn over a mandrel of the hinge region. The cover and the portions of the mandrel can be visible to a user at the hinge region of the electronic device. The cover can be sufficiently rigid to guide a path of the cable and protect the cable from bending beyond a prescribed angle during rotation of the electronic device at the hinge region. The cover can also be sufficiently rigid to prevent ceasing or folding of the cover and the cable during rotation of the electronic device at the hinge region. The cable assemblies can also include a hinged cover that can be pivoted to close a gap between two hinged sections of the electronic device.

An electronic device having an indication member for determining liquid exposure in an electronic device is disclosed. The indication member may include ink and a layer covering the ink. The layer may include a liquid-permeable layer that allows liquid to pass through the layer and contact the ink. In this regard, at least some of the ink may rise through the layer and to a top surface of the indication member. Although the ink may be exposed at the top surface, in some cases, the ink is visible or detectable when exposed to light from an ultraviolet light source. Also, the top surface may include a pattern or other indicia that is also visible or detectable when exposed to the light source. When the indication member is exposed to liquid, the pattern may be altered or disturbed in a location corresponding to an exposed portion of the indication member.

Liquid contact indicator

The described embodiments relate generally to methods to form magnetic assemblies. In particular, extreme cold work (aka cold spray) is used to enhance magnetic properties of a steel alloy (most notably 316L stainless steel and others) that can then be formed into useful shapes and embedded within a substrate without undue machining operations.

Cold spray of stainless steel

Processes for forming cosmetically appealing edges on laminated fabric structures are described. The methods involve a laser cutting process that includes in-process melting of polymer material within the laminated fabric so as to coat fibers of the laminated fabric. The resultant cut laminated fabric has a cosmetic edge that has no exposed fibers. The laser cutting and melting can be performed in a single laser cutting operation, making it well suited for integration into manufacturing product lines.

In-process polyurethane edge coating of laser cut polyurethane laminated fabric

A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

An electronic device can include a processor, output device(s) coupled thereto, and an outer housing or enclosure containing these and other electronic and/or optical items. The enclosure can include a substantially thin contoured component having an external surface exposed to a user and an internal surface. A stiffening plate situated with respect to the internal surface provides a substantial increase in the torsional stiffness and/or bending stiffness of the enclosure. The stiffening plate and contoured component can form a cavity therebetween, and one or more ridges, fins, plates, foam structures and/or other structural items can be located within the cavity. In various embodiments, the device can be a laptop computer and the contoured component can be a dome shaped outer housing behind the display portion thereof.

Electronic device with an enclosure stiffener

An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.

Micro-perforation overmolding gate

The described embodiments relate generally to methods for forming structures by solid state deposition processes. More specifically a method for depositing cold spray over a removable body is disclosed. Methods are also disclosed for affixing operational and structural components to a surface of a device housing with cold spray.

Solid state deposition methods, apparatuses, and products

A method and system for observing and monitoring thermal characteristics of a machining operation, such as a surface finishing operation, performed on a workpiece is disclosed. The surface finishing operation can be performed on the workpiece in order to remove a surface defect, e.g. a parting line, on a surface of the workpiece and/or to provide a mirror-like finish to the workpiece. In one embodiment, an emissive layer is applied to the workpiece to increase a thermal emissivity of the workpiece. In some embodiments, a finishing surface, such as a polishing or buffing wheel, and/or a lubricant used in a finishing operation is monitored. A thermal profile of the surface of the workpiece, finishing surface and/or lubricant can be obtained. The finishing operation can be modified in response to the monitored thermal characteristics to prevent the occurrence of defects and improve the efficacy of the finishing operation.

Thermographic characterization for surface finishing process development

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Gloucester, Canada

Simon Regis Louis Lancaster-Larocque