Taiwan Semiconductor Manufacturing Comp. Ltd.

Via Technologies, Inc.

Smartant Telecom Co., Ltd.

Simon Lin

Chen-Hua Douglas Yu

Hua-Jan Lo

Wei-Shang Chu

Simon Jang

June Chen

Leo Chiang

A method for plasma treating an etched opening formed in a porous low-K material to improve barrier layer integrity including providing a substrate comprising an etched opening formed in an insulating dielectric layer including porous low-K silicon oxide according to an overlying patterned resist layer; plasma treating according to a plasma process the etched opening to remove the resist layer and increase a surface density of the insulating dielectric layer within the etched opening; and, blanket depositing a barrier layer over the etched opening.

Plasma treatment to improve barrier layer performance over porous low-K insulating dielectrics

A low voltage different signaling (LVDS) includes an LVDS transmitter and an LVDS receiver. The LVDS transmitter includes a feedback compensation circuit, which adjusts and stabilizes the analog image signal to be transmitted to the LVDS receiver according to the voltage difference of the analog image signal and a base signal. The feedback compensation circuit includes a voltage-to-current converting circuit and a pair of current mirror circuits.

Low voltage differential signaling device with feedback compensation

Desk antenna

Growing community of inventors

Hsinchu, Taiwan

Simon Lin