Applied Materials, Inc.

Simon Lau

Dieter Haas

Wolfgang Buschbeck

Thomas Berger

The present disclosure provides a holding arrangement. The holding arrangement for holding a substrate includes: a body portion having a first side; a dry adhesive material provided on the first side of the body portion; a seal surrounding the dry adhesive material and configured to provide a vacuum region on the first side, wherein the dry adhesive material is provided in the vacuum region; and a conduit to evacuate the vacuum region.

Method for holding and releasing a substrate

Vacuum processing system with holding arrangement

A holding arrangement for holding a substrate is described. The holding arrangement includes a body having a first wall of flexible material; an adhesive arrangement configured for attaching the substrate, wherein the adhesive arrangement is provided on a first side of the first wall, and a force transmission arrangement configured for applying a force to a second side of the first wall opposing the first side of the first wall.

Holding arrangement for holding a substrate, carrier including the holding arrangement, processing system employing the carrier, and method for releasing a substrate from a holding arrangement

A method and a support for holding a substrate, wherein the support is included in a transportation system configured to transport the substrate. The method includes attaching an adhesive to the support, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the substrate to the support; and attaching the adhesive to the substrate. Moreover, the thickness of the substrate is about 0.3 mm or less, and/or wherein the substrate has a size of 1.4 mor more. The support includes a support body and an adhesive, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the support body to the substrate, wherein the support is included in a transportation system configured to transport the substrate.

Methods and supports for holding substrates

An apparatus for transportation of a substrate carrier in a vacuum chamber is provided. The apparatus includes a first track providing a first transportation path for the substrate carrier, and a transfer device configured for contactlessly moving the substrate carrier from a first position on the first track to one or more second positions away from the first track. The one or more second positions include at least one of a position on a second track and a process position for processing of a substrate. The transfer device includes at least one first magnet device configured to provide a magnetic force acting on the substrate carrier to contactlessly move the substrate carrier from the first position to the one or more second positions.

Apparatus for transportation of a substrate carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a substrate carrier in a vacuum chamber

A substrate support for supporting a substrate in a processing chamber comprises a frame for carrying the substrate, at least a first fastening means fixedly attached to the frame for aligning the substrate relative to the frame, and at least a second fastening means movably attached to the frame, the second fastening means being movable relative to the frame and/or the substrate. Furthermore, a processing device comprises an edge exclusion projecting over a portion of the surface of the substrate in order to prevent processing of the portion of the surface of the substrate. A part of the edge exclusion may be moved into a gap between the edge(s) of the substrate and the frame element of the substrate support to form a labyrinth seal between the frame element and the edge of the substrate. A method of placing the substrate on the substrate support is also disclosed.

Growing community of inventors

Alzenau, Germany

Simon Lau