Kawasaki Robotics (usa), Inc.

Kawasaki Jukogyo Kabushiki Kaisha

Simon Jeyapalan

Avish Ashok Bharwani

Haruhiko Tan

Masaya Yoshida

Ming Zeng

Hajime Nakahara

George Chin

Thomas Miu

Shota Tominaga

Shinya Kitano

Mu-Kai Lin

A substrate conveying robot includes an arm, a substrate holding hand, a sensor board to which a sensor is electrically connected, and a control board on which a controller is mounted, the control board including a universal connector connectable to different types of the sensor boards.

Substrate conveying robot and substrate conveying robot system

An aligner system includes a motor, a rotating device, a control device, and a sensor. The motor generates a rotational drive force. The rotating deviceis rotated by the rotational drive force generated by the motor, while supporting a wafer. The control device controls rotation of the rotating device, and performs a process of setting a rotational phase of the wafer to a predetermined value. The sensor emits a plurality of light beams traveling in different directions toward an edge of the wafer, and receives the light beams to detect a defect in the edge of the wafer.

Aligner apparatus

A substrate handling apparatus according to one or more embodiments may include: a base, an elevating unit that is connected to the base to freely elevate and lower, an arm that is rotatably connected to the elevating unit, a disk that is provided on the arm, and a hand that is rotatably connected to the arm, wherein in case that the hand is provided on a position to overlap the arm, the disk is provided under the substrate extracted by the hand.

Substrate handling apparatus and method of handling substrate

A transport system includes a robot, sensors (an aligner sensor, a protrusion detecting sensor) and a controller. The robot having a hand which supports a wafer and transports the wafer to an aligner apparatus. The sensor detects the position of the wafer before the robot delivers the wafer to the aligner apparatus while supporting the wafer on the hand. The controller determines the positional deviation of the wafer based on a detection value of the sensor.

Transport system and determination method

A robot system according to one or more embodiments may include a robot, and a control part. The robot may include one or more joints driven by an electric motor, and can hold a wafer by a holding part. The control part gives commands to the robot for control. When the robot holds and transports the wafer with the holding part, the control part performs, based on information about the electric motor, at least one of the following: determining whether slippage has occurred between the holding part and the wafer; and estimating an amount of slippage of the wafer relative to the holding part.

Robot system, and slip determination method

A substrate transfer apparatus of the present invention includes: a robot including a hand configured to hold a substrate, and an arm configured to move the hand; a robot control device configured to set a moving path for the hand and control the arm such that the hand moves on the moving path toward a target position; and a camera disposed so as to be able to capture an image of the substrate held by the hand located at a predetermined confirmation position. The robot control device sets the moving path so as to pass through the confirmation position, obtains an image captured by the camera when the hand is located at the confirmation position, calculates a distance between a predetermined environment and the substrate which are taken in the image, and calculates a positional deviation amount from a reference position of the substrate on the basis of the distance.

Substrate transfer apparatus and method of measuring positional deviation of substrate

The present disclosure is directed to methods and systems for evaluating wafer size handling capabilities of wafer handling robots and wafer stations in a wafer processing environment. In one embodiment, a method is provided in which size parameters for each of one or more wafer stations and one or more robot hands of a wafer handling robot are set based on user input. A user command identifying a desired robot hand and a desired wafer station is received. A first size parameter of the desired robot hand is compared to a second size parameter of the desired wafer station. If the first size parameter is equal to the second size parameter, or if the second size parameter is an all-size parameter, the user command is executed. If the first size parameter is not equal to the second size parameter, an error is generated.

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Newark, CA, United States of America

Simon Jeyapalan