Osram Opto Semiconductors Gmbh

Infineon Technologies Ag

Osram Oled Gmbh

Other

Simon Jerebic

Edward Fuergut

Michael Bauer

Markus Pindl

Holger Woerner

Thomas Bemmerl

Peter Strobel

Jens G Pohl

Robert-Christian Hagen

Hermann Vilsmeier

Daniel Leisen

Tobias Gebuhr

Bernd Goller

Jürgen Moosburger

Hans-Christoph Gallmeier

Horst Theuss

Herbert Brunner

Stefan Grötsch

Irmgard Escher-Poeppel

Markus Maute

Martin Brandl

David Racz

Johann Ramchen

Markus Boss

Mathias Kaempf

Michael Kruppa

Frank Singer

Korbinian Perzlmaier

Gerald Ofner

Jörg Erich Sorg

Karlheinz Arndt

Bert Braune

Michael Huber

Guenter Spath

Ingo Neudecker

Jan Marfeld

Christian Stuempfl

Erik Heinemann

Horst Groeninger

Georg Ernst

Philipp Pust

Michael Bestele

Bernd Rakow

Markus Fink

Thomas Zeiler

Stefan Barthel

Günter Spath

Matthias Kiessling

Stephan Preuβ

Edward Fürgut

Hansjörg Schöll

Harald Laux

Herman Vilsmeier

Thomas Birke

Max Wenzel

Harald Dimmelmeier

Benedikt Beer

Stephan Preuß

The invention relates to a housing for a radiation-emitting component, having the following features: —at least one electric contact point which is arranged on a first main surface of the housing and—at least one depression in the first main surface of the housing, said depression being arranged adjacently to the electric contact point. The invention additionally relates to a method for producing a radiation-emitting component and to a radiation-emitting component.

Radiation-emitting component and method for producing same

In an embodiment a method for manufacturing at least one electronic component includes providing a second surface area of the component adjacent to a first surface area, wherein the second surface area is repulsive to a first fluid to be applied, applying the first fluid without additional pressurization to the first and/or second surface area, wherein the first surface area is wetted by the first fluid and the first fluid is repelled from the second surface area and applying a second fluid to the first surface area, to the second surface area and/or to a surface area of the solidified first fluid, after solidification of the first fluid applied to the first surface area, wherein applying the second fluid includes applying a positive pressure, a plasma action and/or a compression molding, and wherein the second fluid wets the second surface area.

Controlled wetting in the manufacture of electronic components

In an embodiment an apparatus includes a delimiting device and a holding device configured to hold the delimiting device at a distance above an optoelectronic light-emitting device and form a layer of a material provided in a flowable state between the delimiting device and the light-emitting device, wherein a bottom side of the delimiting device, which faces the light-emitting device, has a structuring so that a structure complementary to the structuring is producible on an upper side of the layer.

Apparatus and method for forming a layer of a material provided in a flowable state on an optoelectronic light-emitting device

In an embodiment an optoelectronic lighting device includes a carrier, exactly one light-emitting optoelectronic semiconductor component, wherein the semiconductor component has a light emission area on at least one surface side, and wherein the semiconductor component is arranged on an upper side of the carrier, at least one functional layer arranged above the light emission area and/or adjacent to the light emission area and an edging for the functional layer, wherein the edging surrounds the functional layer when viewed in a circumferential direction, the circumferential direction being parallel to the upper side of the carrier around the functional layer, and wherein the edging is formed of a transparent material.

Optoelectronic lighting device, optoelectronic illumination device and method of manufacturing

In an embodiment an optoelectronic component includes a radiation emitting semiconductor chip configured to emit primary electromagnetic radiation from a radiation emission surface, a conversion element configured to convert the primary electromagnetic radiation into electromagnetic secondary radiation, a first potting covering at least one side surface of the semiconductor chip, a second potting arranged on the first potting and an adhesion promoter with which the conversion element is fixed on the radiation emission surface of the semiconductor chip, wherein the adhesion promoter is arranged on a top surface of the first potting, wherein the first potting includes first filler particles, wherein the second potting includes second filler particles, and wherein a mass fraction of the first filler particles is greater than a mass fraction of the second filler particles per volume element.

Optoelectronic component, method for producing an optoelectronic component and lighting device

A method for producing optoelectronic semiconductor components is disclosed. In an embodiment a method includes A) applying radiation-emitting semiconductor chips to an intermediate carrier, wherein the semiconductor chips are volume emitters configured to emit radiation at light exit main sides and on chip side surfaces; B) applying a clear potting permeable to the radiation directly onto the chip side surfaces so that the chip side surfaces are predominantly or completely covered by the clear potting and a thickness of the clear potting in each case decreases monotonically in a direction away from the main light exit sides; C) producing a reflection element so that the reflection element and the clear potting touch on an outer side of the clear potting opposite the chip side surfaces; and D) detaching the semiconductor chips from the intermediate carrier and attaching the semiconductor chips to a component carrier so that the light exit main sides of the semiconductor chips face away from the component carrier.

Method for producing optoelectronic semiconductor components

A method and device for slurrying a suspension, the device including a mixing container with an inlet opening configured to introduce the suspension into the mixing container, a distributor element having a collecting container and an outlet arm fastened to the collecting container, and a shaft with a longitudinal axis, with the shaft and the distributor element arranged inside the mixing container, and the distributor element rotatable around the shaft. The collecting container has a collecting opening that permits passage of the suspension from the inlet opening into the distributor element, the outlet arm has an outflow opening that lets the suspension leave the distributor element, and the outlet arm permitting the suspension to flow out of the distributor element, with a flow of the suspension causing a torque on the distributor element so that the torque supports a rotation around the shaft.

Device for slurrying a suspension and method for operating a device

An arrangement includes a carrier; an optoelectronic component arranged on the carrier; and a material arranged on the carrier, wherein the carrier includes at least one structural element that hinders flow of the material in a flow direction, the structural element extends transversely to the flow direction, and the structural element has a rounding radius in a plane perpendicular to the transverse extent of the structural element less than 20 &#x3bc;m.

Arrangement having a carrier and an optoelectronic component

Disclosed is a radiation-emitting semi-conductor chip () comprising an epitaxial semi-conductor layer sequence () which emits electromagnetic radiation in operation. The epitaxial semi-conductor layer sequence () is applied on a a transparent substrate (), wherein the substrate () has a first main surface () facing the semi-conductor layer sequence (), a second main surface () facing away from the semi-conductor layer sequence () and a first lateral flank () arranged between the first main surface () and the second main surface (), and the lateral flank () has a decoupling structure which is formed in a targeted manner from separating tracks. Also disclosed is a method for producing the semi-conductor chip, and a component comprising such a semi-conductor chip.

Radiation-emitting semiconductor chip, method for producing a plurality of radiation-emitting semiconductor chips and optoelectronic component having a radiation-emitting semiconductor chip

An optoelectronic semiconductor device includes a carrier having a carrier top side, at least one optoelectronic semiconductor chip arranged at the carrier top side and having a radiation main side remote from the carrier top side, at least one bonding wire, at least one covering body on the radiation main side, and at least one reflective potting compound surrounding the semiconductor chip in a lateral direction and extending from the carrier top side at least as far as the radiation main side, wherein the bonding wire is completely covered by the reflective potting compound or completely covered by the reflective potting compound and the covering body, the bonding wire is fixed to the semiconductor chip in an electrical connection region on the radiation main side, and the electrical connection region is free of the covering body and covered partly or completely by the reflective potting compound.

Optoelectronic semiconductor component

The invention relates to an optoelectronic semiconductor chip () comprising a carrier () and a semiconductor body () having an active layer () provided for generating electromagnetic radiation. Said carrier () has a first main surface (A) facing the semiconductor body, a second main surface (B) facing away from the semiconductor body, and a sidewall (C) arranged between the first main surface and the second main surface. The carrier () has a structured region (C) for enlarging the total surface area of the sidewall, wherein the structured region has singulation traces. The invention also relates to an optoelectronic component () comprising such a semiconductor chip and a method for producing a plurality of such semiconductor chips are specified.

Optoelectronic semiconductor chip, optoelectronic component and method for singulating semiconductor chips

An electronic arrangement comprising: a carrier; at least one connecting area on the carrier; at least one electronic component, which is fixed at least on the connecting area by a contact material; a covering area, which surrounds the connecting area on the carrier; and at least one covered region covered by a covering material; wherein the covering area is highly reflective with a reflectivity of greater than 70%, exposed regions on the connecting area and on the contact material are covered with the covering material, and the covering material is colored by titanium dioxide particles in such a way that the titanium dioxide particles are provided in the covering material in a proportion between 25 percent and 70 percent by weight, such that the covering material is highly reflective with a reflectivity of greater than 70% to minimize optical contrast between the covering area and the covered region.

Electronic arrangement

A method for producing a plurality of optoelectronic semiconductor devices is provided. A number of semiconductor chips are fastened on an auxiliary support. The semiconductor chips are spaced apart from one another in a lateral direction. A reflective layer is formed, at least in regions between the semiconductor chips. A composite package body is formed at least in certain regions between the semiconductor chips. The auxiliary support is removed and the composite housing body is separated into a number of optoelectronic semiconductor devices. Each optoelectronic semiconductor device has at least one semiconductor chip, part of the reflective layer and part of the composite package body as a package body.

Method for producing optoelectronic semiconductor devices

An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting compound encloses the semiconductor chip laterally and extends at least as far as the main radiation side of the semiconductor chip. The bonding wire is covered completely by the reflective potting compound or completely by the reflective potting compound together with the covering body.

An electronic arrangement () comprising a carrier (), on which at least one connecting area () is arranged. At least one electronic component () is fixed on the connecting area () by means of a contact material (). A covering area () surrounds the connecting area () on the carrier (). At least one covered region () is covered by a covering material (). The covering material () is designed in such a way that an optical contrast between the covering area () and the covered region () is minimized.

Electronic arrangement and method for producing an electronic arrangement

Growing community of inventors

Tegernheim, Germany

Simon Jerebic