Stmicroelectronics Gmbh

Stmicroelectronics S.r.l.

Hewlett-packard Development Company, L.p.

The Procter Gamble Company

Stmicroelectronics International N.v.

Stmicroelectronics Asia Pacific Pte Limited

Hewlett-packard Company

Stmicroelectronics (malta) Ltd

Hewlett-packard Development, L.p.

Simon Dodd

Dana Paul Gruenbacher

Faiz Feisal Sherman

Joseph Edward Scheffelin

David S Hunt

Dave Hunt

Joe Scheffelin

Teck Khim Neo

Domenico Giusti

Joseph M Torgerson

Stephan Gary Bush

Frank R Bryant

Michael D Miller

Roberto Brioschi

Matt Giere

Steven L Webb

Terry E McMahon

Uwe Schober

Stefan Hubert Hollinger

Sean P McClelland

Peter Janouch

Andrea Nicola Colecchia

Mark H MacKenzie

Angela White Bakkom

Steve G Bush

Paul I Mikulan

Timothy James Hoekstra

Mark H Mackenzie

Marco Ferrera

Robert N K Browning

Antonio Cruz-Uribe

Carlo Luigi Prelini

Dennis W Tom

Luca Molinari

Richard Todd Miller

Colby Van Vooren

Mauro Pasetti

S Jonathan Wang

Gregory T Hindman

Franco Consiglieri

Ivan Ellul

Lonnie Byers

Christopher Brincat

Marco De Fazio

Trudy L Benjamin

Thomas Elliot Rabe

Stephan James Andreas Meschkat

Grant Edward Anders Striemer

Kevin Bruce

Daniele Prati

David Burney

Tim Hoekstra

Joseph Edward Schefflin

Robert N Browning

Terry E Mcmahon

Domenco Giusti

The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.

Microfluidic delivery system with a die on a rigid substrate

The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.

Support substrates for microfluidic die

A microfluidic MEMS device is formed by a plurality of ejection cells each having a fluid chamber; an actuator chamber; a membrane having a first surface facing the actuator chamber and a second surface facing the fluid chamber; a piezoelectric actuator on the first surface of the membrane; and a passivation layer on the piezoelectric actuator. The membrane has an elongated area defining a longitudinal direction and a transverse direction. The passivation layer has a plurality of holes. The holes extend throughout the thickness of the passivation layer and, in a plan view, have an elongated shape with a greater dimension parallel to the longitudinal direction of the membrane and a smaller dimension parallel to the transverse direction.

Microfluidic MEMS device for fluid ejection with piezoelectric actuation

Included are embodiments of an angled cartridge assembly for modifying a treating surface. These embodiments may include a reservoir for storing a treatment composition, the treatment composition for being applied to the treating surface. Embodiments may also include a body portion that is coupled to the reservoir, where the body portion comprises a base surface and a dispensing surface, where the dispensing surface is disposed opposite the base surface on the angled cartridge assembly, and where the dispensing surface is disposed in a nonparallel configuration relative to the base surface.

Angled cartridge assembly for a dispensing device

Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.

Methods of forming and using fluid ejection devices and printheads

Microfluidic delivery systems for dispensing a fluid composition into the air comprising microfluidic die and at least one heating element that is configured to receive an electrical signal comprising a certain on-time and wave form to deliver a fluid composition into the air.

Microfluidic delivery system

The present disclosure is directed to a greenhouse or single container for plant growth coupled to the Internet of Things and including a microfluidic die for water or nutrient distribution. The microfluidic die is controllable automatically or with instructions from a remote user, based on sensors included within a growth environment.

Aeroponics system with microfluidic die and sensors for feedback control

The present disclosure provides supports for a microfluidic die and one or more additional die including, but not limited to, microfluidic die, ASICs, MEMS devices, and sensors. This includes semi-flexible supports that allow a microfluidic die to be at a 90 degree angle with respect to another die and rigid supports that allow a microfluidic and another die to be in close proximity to each other.

Microfluidic die on a support with at least one other die

A method of connecting a cartridge comprising a fluid composition with a microfluidic delivery system is provided. The method includes the steps of: providing a housing comprising electrical contacts, wherein the electrical contacts of the housing are disposed on a first plane; providing a cartridge comprising a reservoir for containing a fluid composition, a die comprising a nozzle, and electrical contacts that are in electrical communication with the die, wherein the electrical contacts of the cartridge are disposed along a second plane that is parallel with the first plane; and connecting the cartridge with the housing by moving the cartridge in a direction parallel with the second plane toward the housing until the electrical contacts of the cartridge are in electrical communication with the electrical contacts of the housing.

Microfluidic delivery cartridges and methods of connecting cartridges with microfluidic delivery systems

The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

Microfluidic system with single drive signal for multiple nozzles

A microfluidic die is disclosed that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.

Fluid ejection device

Fluid ejection device and printhead

Growing community of inventors

West Linn, OR, United States of America

Simon Dodd