Flextronics Ap, LLC

Solectron Invotronics

Simon Chamuczynski

Gary Warren

Reginald C Grills

Darren Van Roon

Brian Sneek

A method and apparatus for heat sinking a camera module, which may be used in an automotive camera, which includes but is not limited to automotive rear-view cameras, is described herein. Heating conductors and heat conductive pads may be arranged in a parallel orientation within the housing of the camera module to dissipate heat produced by the printed circuit boards (PCBs) and other components within. The heat conducting pads may conduct heat away from the PCB or component being cooled and into the heat sink, which may be a heat conducting material including but not limited to aluminum, aluminum alloys, or copper. The heating pads may also fill the air gaps within the housing of the camera module.

Method and system for heat sinking of camera module

A conducting contact pair for a switch has a first conducting contact formed by a plurality of outward extending radial fingers arranged on a substrate, and a second conducting contact formed by a plurality of inward extending radial fingers. The first conducting contact and the second conducting contact are arranged with each inward extending radial finger extending between a corresponding pair of adjacent outward extending radial fingers. A bridge conductor is selectively pressed against the first conducting contact and the second contact to bridge any of the inward extending fingers to either of pair of adjacent outward extending radial fingers that it extends between.

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Oshawa, Canada

Simon Chamuczynski