Infineon Technologies Austria Ag

Silke Auchter

Clemens Roessler

Johanna Elisabeth Roessler

Martin Gruber

Gerald Stocker

Clemens Rössler

Ralf Otremba

Josef Höglauer

Helmut Schoenherr

Matthias German Dietl

Lina Purwin

Alexander Zesar

Günther Lohmann

Peter Oles

A device for trapping ions includes: a substrate having a metal layer structure; and at least one ion trap configured to trap ions in a space over the substrate. The metal layer structure is a multi-layer metal structure that includes: a top metal layer having one or more electrodes forming part of the at least one ion trap; a redistribution metal layer having wiring for connecting the one or more electrodes; a first insulating layer arranged between the top metal layer and the redistribution layer and having one or more voids; and one or more connection elements arranged in the one or more voids that connect the wiring from the redistribution metal layer with the one or more electrodes in the top metal layer.

Device for controlling trapped ions

A device for controlling trapped ions includes a substrate. A first metal layer is disposed over the substrate. An insulating layer is disposed over the first metal layer. A structured second metal layer is disposed over the insulating layer. The structured second metal layer includes an electrode of an ion trap configured to trap ions in a space above the structured second metal layer. The electrode of the structured second metal layer and the first metal layer overlap each other. The device further includes a void space in the insulating layer between the first metal layer and the electrode of the structured second metal layer, the void space including a vacuum at least during operation of the device.

Device for controlling trapped ions with low heat dissipation

A cryostat socket for holding an ion trap device mounted on a substrate in a cryostat includes a housing frame provided for pre-assembly in the cryostat. A pin insert is arranged in the housing frame. The pin insert includes a base plate and contact pins. The contact pins are arranged in an array. A housing cover has a receptacle for the substrate. The housing cover, when assembled with the housing frame, exerts a compressive force on a front side of the substrate by which a rear side of the substrate is pressed onto the contact pins.

Cryostat socket for holding an ion trap device mounted on a substrate in a cryostat

A device for trapping ions includes: a first substrate having an upper multi-layer electrode structure implemented at a top side of the first substrate; a second substrate disposed over the first substrate and having a lower multi-layer electrode structure implemented at a bottom side of the second substrate; and one or more first level ion traps configured to trap ions in a space between the first substrate and the second substrate. The one or more first level ion traps includes the upper multi-layer electrode structure of the first substrate and the lower multi-layer electrode structure of the second substrate. A method of controlling trapped ions in a device is also described.

Device having one or more first level ion traps

A device for controlling trapped ions includes a first semiconductor substrate. A second semiconductor substrate is disposed over the first semiconductor substrate. At least one ion trap is configured to trap ions in a space between the first semiconductor substrate and the second semiconductor substrate. A spacer is disposed between the first semiconductor substrate and the second semiconductor substrate, the spacer including an electrical interconnect which electrically connects a first metal layer structure of the first semiconductor substrate to a second metal layer structure of the second semiconductor substrate.

Device for controlling trapped ions and method of manufacturing the same

A device for controlling trapped ions includes a first substrate. A second substrate is disposed over the first substrate. One or a plurality of first level ion traps is configured to trap ions in a space between the first substrate and the second substrate. One or a plurality of second level ion traps is configured to trap ions in a space above the second substrate. An opening in the second substrate is provided through which ions can be transferred between a first level ion trap and a second level ion trap.

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Villach, Austria

Silke Auchter