Hewlett-Packard Development Company, L.p.

Silam J Choy

Michael W Cumbie

Chien-Hua Chen

Devin Alexander Mourey

Rio Rivas

Rhonda Lynn Wilson

Garrett E Clark

Ed Friesen

Kelly Ronk

Jeffrey Allen Nielsen

Kevin E Swier

Christie Dudenhoefer

Kenneth Ward

Gary G Lutnesky

Zhuqing Zhang

Alexander N Govyadinov

David N Olsen

Pavel Kornilovich

Joseph Edward Scheffelin

Peter James Fricke

David Ridgway Otis, Jr

Robert G Walmsley

Tony S Cruz-Uribe

Patrick V Boyd

Eric Lee Nikkel

Arun K Agarwal

Terry M Lambright

Brett E Dahlgren

Martha A Truninger

Steven T Castle

Blair M Kent

Tsuyoshi Yamashita

George Z Radominski

Jennifer Wu

Hilary Ely

Holli C Ogle

Chris Aschoff

Christopher Vitello

Mark Daniel Tucker

John Lahmann

Sheldon A Bernard

David R Otis

An example method includes providing fluid to a chamber. The chamber feeds a first channel terminating at a first droplet ejector and a second channel terminating at a second droplet ejector. The method further includes sequencing ejection of droplets at the first droplet ejector and the second droplet ejector to induce negative pressure to provide a sequenced output flow of the fluid through the first channel to a first target microfluidic network and through the second channel to a second target microfluidic network, and controlling the first and second target microfluidic networks to perform an analytical process with the fluid.

Sequenced droplet ejection to deliver fluids

A microfluidic device includes a microfluidic chamber fluidly coupled to an inlet port and an outlet port, a semiconductor microchip including fluid active circuitry and transistor circuitry, and a bed of solid supports positioned within the microfluidic chamber fluidly positioned between the inlet port and the outlet port. The transistor circuitry in this example provides onboard logic at the semiconductor microchip to control fluid active circuitry. The semiconductor microchip also defines a portion of the microfluidic chamber.

Microfluidic devices

In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.

Molded printhead

A digital dispense apparatus includes at least one fluid dispense device, at least one reservoir fluidically connected to the at least one fluid dispense device, a monolithic carrier structure carrying the at least one fluid dispense device and reservoir, the monolithic carrier forming fluid routing between the reservoir and the fluid dispense device.

Monolithic carrier structure including fluid routing for digital dispensing

A digital dispense apparatus comprising a plurality of fluid dispense devices, at least one reservoir connected to the plurality of fluid dispense devices to deliver fluid to the plurality of fluid dispense devices, at least one contact pad array, and a single monolithic carrier structure.

Monolithic carrier structure for digital dispensing

In one example, a fluid flow structure includes a micro device embedded in a monolithic molding having a channel therein through which fluid may flow directly to the device.

Molded fluid flow structure

A printhead includes a moldable substrate, and a number of printhead dies molded into the moldable substrate. The printhead dies include a number of printhead dies molded into the moldable substrate. The dies comprise a non-rectangular shape. A number of fluid slots are defined in the moldable substrate to fluidically coupled to the printhead dies to feed fluid to the printhead dies. The number of fluid slots is not equal to the number of printhead dies.

Printhead

In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.

Vent

In one example in accordance with the present disclosure a printer cartridge is described. The printer cartridge includes multiple backpressure chambers in fluid communication with a shared free fluid chamber. The backpressure chambers are to supply a fluid to nozzles of a portion of a fluidic ejection assembly and to provide backpressure to the nozzles of the fluidic ejection assembly during deposition of fluid onto a print medium.

Printer cartridge with multiple backpressure chambers

In an example, a fluid ejection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity.

Printed circuit board fluid ejection apparatus

In one example in accordance with the present disclosure a flexible printhead is described. The printhead includes a number of printhead die, a printhead die including a number of nozzles to deposit an amount of fluid onto a print medium. The printhead also includes a fluid delivery system to deliver the amount of fluid from a fluid supply to the number of nozzles. The printhead also includes a number of electrical circuits to electronically couple the number of printhead die with a printing device. The printhead also includes a flexible substrate on which the number of printhead die and the number of electrical circuits are mounted.

Printhead with flexible substrate

A fluid dispenser may include an array of fluid delivery assemblies. Each fluid delivery assembly may include orifices through which fluid is to be ejected and slots. Each slot extends to a respective one of the orifices. The slots have different geometric shapes.

Fluid dispenser

A fluid manifold may include a number of blades and a number of end pieces securing the blades in place wherein the fluid manifold interfaces between a printhead die and a number of fluid source slots. A method of manufacturing a fluid manifold may include arranging a number of metal blades to form a relatively larger pitch between blades on a bottom side of the arranged blades than on a top side the arranged blades and mounting the arranged blades to a mounting structure formed to receive each blade as arranged.

Fluid manifold

A printhead may include a number of s-shaped dies embedded in a moldable substrate. An medium-wide array may include a number of printheads with each printhead including a number of s-shaped dies and an ejection fluid feed slot to provide a single type of ejection fluid to the s-shaped dies. An s-shaped die of a printhead may include a number of columns of nozzles and an electrical interconnect coupled to a number of firing chambers associated with each of the nozzles, the electrical interconnect positioned adjacent to the number of columns.

Printhead with s-shaped die

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Corvallis, OR, United States of America

Silam J Choy