Hitachi, Ltd.

Hitachi Haramachi Electronics Co., Ltd.

Sigeki Sekine

Ryuichi Saito

Yoshihiko Koike

Yuuji Wakisawa

Makoto Kitano

Hisanori Okamura

Nobuya Koike

Noboru Baba

Masahiko Sakamoto

Hirosi Akiyama

Hideya Kokubun

A high reliability electric power control semiconductor device with a prolonged product lifetime has been provided by successfully suppressing the metal support plate or the metal heat dissipation plate from warping due to the thermal stress during bonding so as to prevent the occurrences of cracks and gaps in the brazing fillers in the bonded layers between the metal heat dissipation plate or the metal support plate and the insulation plate in the semiconductor device comprising the semiconductor elements, metal heat dissipation plate, thermal stress buffer, insulation plate, and the metal support plate, wherein at least one of the metal heat dissipation plate and the metal support plate comprises a copper alloy of which a softening temperature at which a hot hardness of which becomes 1/2 of the hardness at the room temperature is 350.degree. C. or more. Further, in the semiconductor device fabricated by bonding the semiconductor elements via the thermal stress buffer, the heat dissipation plate and the insulation plate onto the metal support plate, the heat dissipation plate comprises a portion having a reduced thickness in the periphery thereof machined by counterboring or the like.

Semiconductor device having thermal stress resistance structure

A semiconductor module having heat sink plates and an insulating plate laminated under the semiconductor chips, wherein the thickness of the support base plate is set to be 2.5 times in thickness of the insulating plate, which is the maximum thickness among the heat sink plates and the insulating plate laminated in the semiconductor module, so that the thermal fatigue lives of the solder layers are balanced, and the life of the whole semiconductor module can be prolonged.

Semiconductor module with an improved heat sink/insulation plate

Semiconductor module with a plurality of power devices mounted on a

Growing community of inventors

Hitachi, Japan

Sigeki Sekine