Kulicke and Soffa Investments, Inc.

Kla Tencor Corporation

Sigalit Robinzon

Benjamin Sonnenreich

Amnon Manassen

Vladimir Levinski

Mark Ghinovker

Yoel Feler

Nuriel Amir

Inna Tarshish-Shapir

Boris Efraty

Anat Marchelli

Berta Dinu

Methods and systems are provided, which identify specified metrology target abnormalities using selected metrics and classify the identified target abnormalities geometrically to link them to corresponding sources of error. Identification may be carried out by deriving target signals such as kernels from specified regions of interest (ROIs) from corresponding targets on a wafer, calculating the metrics from the target signals using respective functions and analyzing the metrics to characterize the targets.

Method, system, and user interface for metrology target characterization

A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.

Bonding tool with polymer coating

Growing community of inventors

Timrat, Israel

Sigalit Robinzon