Pyxis Cf Pte. Ltd.

Siew Wen Lee

Amlan Sen

Hwee Seng Chew

Wai Hoe Lee

Qing Feng Guan

Li Jiang Huang

Kin Fei Chooi

A die bonding apparatus having: a carrier support unit having at least one support element defining a supporting plane and a carrier holder operable to support the carrier panel on a side of the supporting plane with the carrier panel being parallel to the supporting plane, a wafer feed unit having a wafer holder operable to hold a diced wafer in a manner so as to space the diced wafer apart from the supporting plane defined by the at least one support element of the carrier support unit and orient the diced wafer with an exposed surface of the diced wafer facing the side of the supporting plane to which the carrier panel is supported, and a die transfer module disposed between the carrier support unit and the wafer feed unit, the die transfer module operable to transfer a die from the diced wafer to the carrier panel.

Growing community of inventors

SINGAPORE, Singapore

Siew Wen Lee