Intel Corporation

Siew Fong Tai

Munehiro Toyama

Kian Sin Sim

Charan K Gurumurthy

Tamil Selvy Selvamuniandy

Selvy Tamil Selvamuniandy

Charavanakumara Gurumurthy

Chee Key Chung

Kum Foo Leong

A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

Grid array connection device and method

A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second major surface. At least some of the pads include a barrier layer having pores or openings therein. When solder is placed on the pad, the barrier layer forms an intermetallic compound at a rate different from the rate of the intermetallic compound formed between the pad and the solder. The result is a solder ball on a pad that has a first intermetallic compound and a second intermetallic compound.

Solder interface locking using unidirectional growth of an intermetallic compound

Growing community of inventors

Selangor, Malaysia

Siew Fong Tai