Infineon Technologies Ag

Osram Gesellschaft MIT Beschrankter Haftung

Siegfried Ramminger

Thomas Licht

Gerhard Mitic

Hans-Peter Degischer

A composite material and a base plate made of this composite material for mounting electrical components and for connecting these components to a cooling device is disclosed. In one embodiment, the composite material includes a matrix material and fibers embedded therein. The fibers have in this case an anisotropic, directionally optimized distribution in the matrix material, so that heat occurring in a locally confined area can be effectively distributed and dissipated. The material of the fibers includes SiC, highly graphitized carbon or diamond. The fibers are arranged in the matrix material in various fiber levels, the fibers in the upper fiber levels being oriented predominantly horizontally in relation to a reference area and the fibers in the lower fiber levels being oriented predominantly vertically in relation to the reference area.

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Munich, Germany

Siegfried Ramminger