Hewlett-packard Company

Other

Lambda Physik Ag

Siegfrid Dippon

Si-Ty Lam

Wilhelm Tamm

Walter Olbrich

Herbert Gross

Hans-Jurgen Kahlert

Heinrich Endert

Michael Weitmann

Joachim Schulte In Den Baumen

Robert Grub

Jurgen Schweizer

Process for manufacturing circuit boards in which a masking layer (2) is applied to a carrier substrate (1) of insulating material and after producing openings for soldering pads, conductor traces, and through or blind holes, in accordance with a preferred embodiment by laser ablation, a thin electrically conductive layer (5) is applied to the surface of the carrier substrate including the masking layer. Subsequently, the masking layer (2) and the conductive layer deposited thereon, for example copper, are removed and the remaining metal surfaces (6) are chemically reinforced to produce the desired thickness. The process permits the production of dense structures using few process steps and without additional abrasion steps.

Process for manufacturing printed circuit boards

An apparatus for laser machining by creating a plurality of discrete and separate beams which are sent to a deflecting device including a support and a plurality of individual elements that act independently and are individually controlled to machine different points on the workpiece simultaneously.

Apparatus for laser machining with a plurality of beams

A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or holes. Conductive material is then deposited on substantially an entire face of the substrate. Conductive material is then removed from the substrate outside the desired pattern of conductor structures and/or holes.

Method of manufacturing printed circuit boards

Growing community of inventors

Gechingen, Germany

Siegfrid Dippon