Hon Hai Precision Industry Co., Ltd.

Sidney Lu

Iosif R Korsunsky

Ming-Lun Szu

Nick Lin

Wen-Chun Pei

Caesar Chen

A method for electrically interconnecting two printed circuit boards includes the steps of: providing a first printed circuit board (); providing a second printed circuit board (); providing a receiving slot () in one of the first and the second printed circuit boards such that the first and the second printed circuit boards are orthogonally intersected with each other; and providing at least one electrical connector () adjacent the receiving slot and in electrical connection with the first and the second printed circuit boards.

Method for interconnecting multiple printed circuit boards

A BGA socket ( ) comprises a base ( ) defining a plurality of contact passageways ( ), a plurality of contacts ( ) received in the contact passageways, and a cover ( ) movably mounted on the base. Each contact has a fitting portion ( ) fixedly engaging with the base, a contact portion ( ) formed above the fitting portion for engaging with a pin of an IC module, and a contact pad ( ) below the fitting portion for being soldered to a printed circuit board. The bottom surface ( ) of the contact pad has a plurality of bumps ( ). A solder ball ( ) is soldered to the bottom surface of the contact pad and bonded with the bumps.

BGA socket with improved contacts

An electrical connector comprises a housing having first and second surfaces and forming a plurality of contact supports formed therein. A plurality of electrical contacts is moveably attached to each corresponding support and has a first contacting end extending beyond the first surface for driving the contact to move along the support upon mating with an electrical device.

Electrical connector

An electrical connector for electrically connecting a chip module to a circuit board comprises a dielectric base, a dielectric cover, a number of contacts and a positioning member. Each contact comprises a contact portion received in the base and a joining portion extending into the positioning member. The positioning member has a number of guiding holes and a number of conical receiving recesses having solder balls deposited therein. The guiding holes of the positioning member snugly receive the joining portions of the corresponding contacts thereby preventing molten solder from flowing into the base. The positioning member may be made of the same dielectric material as the mating circuit board thereby eliminating different thermal expansion between top and bottom surfaces of the solder balls due to a difference in coefficients of thermal expansion between the electrical connector and the mating circuit board.

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Cupertino, CA, United States of America

Sidney Lu