Sheldahl, Inc.

Sidney J Roberts

Eugene T Selbitschka

Deanna M Dowdle

Glenn W Gengel

Brent N Sweitzer

Robert J Huschle

A metallized laminate material for the manufacture of high performance, high density printed wiring boards and the like includes an ordered distribution of via holes electrically interconnecting opposing conductive layers on a dielectric polymeric film substrate. Furthermore, opposing photoresist layers substantially cover the conductive layers and vias. The conductive material in the conductive layers and the vias is bonded adhesivelessly to the substrate to provide a high degree of delamination resistance. The production of metallized laminate material is preferably carried out in a roll-to-roll process suitable for high volume, low cost production. In use, an end user may manufacture customized printed wiring boards in small volume runs from the laminate material with a reduced amount of equipment, expertise and cost.

Metallized laminate material having ordered distribution of conductive

An improvement in the method of preparing a coating or layer of reprographic material upon a substrate which includes the conventional steps of coating the substrate surface with a layer of resinous binder curable upon exposure to radiant energy including electron beam and ultraviolet radiation, the binder layer containing reprographic solids. The resinous binder is applied as a fluid and is irradiated until a coherent and adherent layer is formed. The method includes the steps of forceably applying and tautly maintaining a sheet of a smooth flexible film against the surface of the curable resinous binder while directing a beam of radiant energy through the sheet and onto the binder while the layer of flexible film is held thereagainst. The exposure to radiant energy is continued until the resinous binder is substantially completely cured, whereupon the sheet of flexible film is removed from the surface of the binder. The reprographic solids preferably consist of cadmium sulfide, cadmium selenide, or alloys thereof.

Preparation of photoconductive film using radiation curable resin

A splicing system for the butt splicing of endless flexible abrasive belts which employs an adhesive having a multiplicity of unidirectionally oriented reinforcing fibers spanning the butt-joint to form a durable long lasting splice. The fibers which are embedded in a cohesive member form a reinforcement strip which is bonded to the abrasive belt surface. The fibers are high-modulus organic fibers, preferably having a tensile modulus in excess of about 15.times.10.sup.6 psi, and with a tensile strength in excess of 200,000 psi.

Growing community of inventors

Dennison, MN, United States of America

Sidney J Roberts