E.i. Dupont De Nemours and Company

Cda Processing Limited Liability Company

Sidney G Cox

Christopher Dennis Simone

David Ross McGregor

Carl Robert Haeger

Richard A Wessel

Willima J Borland

The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3',4,4&#x2032;-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2&#x2032;-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4&#x2032;-oxydianiline.

Growing community of inventors

Durham, NC, United States of America

Sidney G Cox