Apple Inc.

Sidharth S Dalmia

Kiranjit Dhaliwal

Flynn P Carson

Kumar Nagarajan

Wansuk Yun

Flexible cables may include multiple power, ground, and signal traces, and include EM interference suppression devices within the cable itself. Signal traces may be shielded by ground traces. The body of a cable may be divided into lateral portions through which different types of traces extend. One lateral side of a cable body may include a stack of power traces, while another lateral side of the cable body may include ground and signal traces. EBG patterns may be incorporated into ground traces. Capacitors may be positioned within the cable along its length, mounted between power and ground traces, for decoupling.

Hybrid cabling solution for higher bandwidth and millimeter wave applications

A radio frequency package includes a baseband processor, a transceiver, and a memory. The baseband processor performs processing for wireless communication functions. Moreover, the transceiver transmits and receives wireless signals based on the processing of the wireless communication functions. Additionally, the memory is associated with the baseband processor and stores instructions for performing the processing. The memory and the baseband processor are disposed on top of the transceiver.

System packaging for cellular modem and transceiver system of heterogeneous stacking

A radio frequency package includes a first portion of an antenna array module, a second portion of the antenna array module, and a flexible cable. The first portion of the antenna array module provides a first wireless communication functionality and the second portion of the antenna array module provides a second wireless communication functionality. The flexible cable includes first surface directly coupled to the first portion of the antenna array module. The flexible cable also includes a second surface directly coupled to the second portion of the antenna array module. The flexible cable communicates signals between the first portion of the distributed antenna array module and the second portion of the antenna array module.

Growing community of inventors

San Jose, CA, United States of America

Sidharth S Dalmia