Intel Corporation

Tyco Electronics Corporation

Tyco Electronics Services Gmbh

Planarmag, Inc.

Sidharth Dalmia

Trang Thuy Thai

William J Lambert

Omer Asaf

Josef Hagn

Jonathan Jensen

Ana M Yepes

Baljit Singh

Miroslav Baryakh

Zhichao Zhang

Igal Kushnir

Arnaud Lucres Amadjikpe

Shilpa Talwar

Kameran Azadet

Hosein Nikopour

Bryan K Casper

Ofir Degani

Wook Bong Lee

Ashoke Ravi

Michael Genossar

Claudio Da Silva

Stefano Pellerano

Debabani Choudhury

Rotem Banin

Albert Molina

Georgios Yorgos Palaskas

Duncan Kitchin

Oner Orhan

Saku Lahti

Emanuel Cohen

Gadi Shor

Mikko S Komulainen

Jayprakash Thakur

Eren Sasoglu

Menashe Soffer

Kunal Datta

Moshe Teplitsky

Run Levinger

Benjamin Jann

Chintan S Thakkar

Eshel Gordon

Nebil Tanzi

Erkan Alpman

Raanan Sover

Jiwei Sun

Ron Pongratz

Tawfiq Musah

Peter Sagazio

Zhenguo Jiang

Amit Freiman

Eyal Goldberger

Yossi Tsfati

Shuhei Yamada

Kaushik Dasgupta

Eran Gerson

Shmuel Ravid

Noam Kogan

Nir Weisman

William Lee Harrison

Resti Montoya Moreno

Marian K Verhelst

Meir Gordon

Anandaroop Chakrabarti

Naftali Landsberg

Ra'anan Sover

Steven R Kubes

Mikko M Lampinen

Avi Tsarfati

Lior Shakedd

Kirthika Nahalingam

Mark McGrath

Ozgur Inac

Anat Bazov

Stefano Brenna

Saeid Daneshgar Asl

Swathi Vijayakumar

Nathan G Narevsky

Amr M Fahim

Simon Svendsen

Eytan Mann

Carlton E Hanna

Daniel R Cox

Evan A Chenelly

Gregory Chance

Quan Qi

Bhagyashree S Ganore

Omkar G Karhade

Fay Hua

David Bruce Sarraf

Ofer Markish

Xiaoqian Li

Gregory W Chance

Brandon R Davis

Richard S Perry

Raymond Howard Kohler

Mohammad Siddique Ahmed

James E Quilici

Jaydip Das

Stephen Mark Jackson

Haiying Li

Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Antenna modules and communication devices

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

Wireless communication technology, apparatuses, and methods

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

Antenna boards and communication devices

Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

Radio frequency front-end structures

Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.

Integrated circuit packages, antenna modules, and communication devices

The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.

Compact radio frequency (RF) communication modules with endfire and broadside antennas

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Embodiments include an electronic package that includes a radio frequency (RF) front end. In an embodiment, the RF front end may comprise a package substrate and a first die attached to a first surface of the package substrate. In an embodiment, the first die may include CMOS components. In an embodiment, the RF front end may further comprise a second die attached to the first surface of the package substrate. In an embodiment, the second die may comprise amplification circuitry. In an embodiment, the RF front end may further comprise an antenna attached to a second surface of the package substrate. In an embodiment, the second surface is opposite from the first surface.

5G mmWave antenna architecture with thermal management

For example, an apparatus may include a Printed Circuit Board (PCB) including a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect a Surface Mounted Device (SMD) to the PCB; an antenna disposed on a second side of the PCB opposite to the first side, the antenna to communicate a Radio Frequency (RF) signal of the SMD; and an RF transition to transit the RF signal between the BGA and the antenna, the RF transition including a plurality of signal buried-vias; a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna.

Apparatus and system of a printed circuit board (PCB) including a radio frequency (RF) transition

Described is an apparatus which comprises: a first transmission path for a first frequency band; a second transmission path for a second frequency band different from the first frequency band; a node common to the first and second transmission paths, the node to be coupled to an antenna; and a transmission-zero circuit coupled to the common node.

Parasitic-aware integrated substrate balanced filter and apparatus to achieve transmission zeros

Growing community of inventors

Fair Oaks, CA, United States of America

Sidharth Dalmia