Hewlett-packard Development Company, L.p.

Siddhartha Bhowmik

Rio Rivas

Swaroop K Kommera

David M Braun

Richard J Oram

Manish Giri

Sriram Ramamoorthi

Eric Lee Nikkel

Robert N K Browning

Richard W Seaver

Ed Friesen

Bradley D Chung

Mark C Huth

Jon A Crabtree

Alok Sharan

Samson Berhane

Joshua W Smith

Charles Gustav Schmidt

Robert K Messenger

Christopher C Aschoff

Phillip G Rourke

Manishi Giri

Philip G Rourke

Steven E Kelly

Rocky H Knuth

Rob Pugliese

Becky Clark

Gerald R Wonnacott

Robert NK Browning

A print head die () includes slot ribs () having edges () with triangular notches. In one embodiment, the print head die is formed by dry etching from a first side () of a wafer () a series of spaced openings () completely through the wafer () and separated by ribs () followed by wet etching the wafer () from a second opposite side () to recess the ribs () from the second side ().

Print head slot ribs

Thermal inkjet print head, comprising a fluid feed channel for delivering fluid, fluid chambers arranged near the fluid feed channel for receiving fluid from the fluid feed channel, resistors for actuating the fluid in the chambers, arranged in a staggered pattern with respect to a fluid feed channel wall, and a cantilever extending over the fluid feed channel wall, having a staggered edge that follows the staggered pattern of the resistors.

Print head

A method of method of making a corrosion resistant print head die comprises creating a self-ionized plasma (SIP) of a coating material; establishing a bias on a print head die comprising a plurality of feed slots (), each feed slot () comprising side wall surfaces (); and causing the coating material plasma to be deposited on the surfaces to form a protective coating, wherein at least a portion of the coating material is deposited on at least a portion of the surfaces by resputtering. In some cases, the feed slots have an aspect ratio greater than 2. In some cases, the feed slot comprises at least one rib (), each rib () comprising a top surface (), two side surfaces (), and an under surface (), and the formed protective coating is deposited on the top surface (), two side surfaces (), and under surface () of each rib ().

Protective coating for print head feed slots

Manufacturing method for an inkjet print head, comprising forming a nozzle layer onto a substrate, depositing an LSE (low surface energy) coating onto the nozzle layer, depositing a sacrificial film onto the LSE coating, post processing the substrate, and removing the sacrificial film from the LSE coating, the LSE coating having a water contact angle of at least 50&#xb0; after removal of the sacrificial film.

Manufacture of a print head

A printing device () including a substrate () having an aperture () extending therethrough, wherein the aperture includes a side wall and defines a liquid ink flow path, an ink firing chamber () fluidically connected to the aperture, and a coating positioned on the side wall of the aperture, the coating being impervious to etching by liquid ink, and wherein the coating is chosen from one of silicon dioxide, aluminum oxide, hafnium oxide and silicon nitride.

Printing device

Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.

Print head die slot ribs

A fluid ejection cartridge includes a body, having fluid passageways at a first spacing, a die, having fluid passage-ways at a second closer spacing, and an interposer, bonded to the body at a first surface and plasma bonded to the die at a second surface. The interposer includes fluid passageways between the first and second surfaces, which are substantially aligned with the respective passageways of the body and the die.

Fluid ejection cartridge and method

A slot is formed that reaches through a first side of a silicon substrate to a second side of the silicon substrate. A trench is laser patterned. The trench has a mouth at the first side of the silicon substrate. The trench does not reach the second side of the silicon substrate. The trench is dry etched until a depth of at least a portion of the trench is extended approximately to the second side of the silicon substrate (). A wet etch is performed to complete formation of the slot. The wet etch etches silicon from all surfaces of the trench.

Formation of a slot in a silicon substrate

A silicon nitride layer is formed on at least a back side of a silicon wafer substrate of a semiconductor device. An oxide layer is formed on at least the silicon nitride layer on the back side of the substrate. The oxide layer protects the silicon nitride layer during processing of the device. The oxide layer is removed prior to packaging the device. After components have been formed on a front side of the substrate opposite the back side, packaging is attached to the silicon nitride layer. The components provide a functionality of the device. The silicon nitride layer completely remains on the back side of the substrate after fabrication of the device has been completed. The silicon nitride layer is adapted to minimize and does minimize bowing of the device.

Formation of silicon nitride layer on back side of substrate

The described embodiments relate to substrates having features formed therein and methods of forming same. One exemplary method forms a blind feature through a majority of a thickness of a substrate, the blind feature being defined by at least one sidewall surface and a bottom surface. The method also applies an etch resistant material to the blind feature and removes the etch resistant material from at least a portion of the bottom surface. The method further wet etches the substrate at least through the bottom surface sufficient to form a through feature through the thickness of the substrate.

Substrates having features formed therein and methods of forming

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Salem, OR, United States of America

Siddhartha Bhowmik