Poongsan Corporation

Sidam Lee

Wonshin Kwak

Wonseok Jeong

Disclosed are a copper-cobalt-silicon-iron-phosphorus (Cu&#x2014;Co&#x2014;Si&#x2014;Fe&#x2014;P)-based alloy having strength, electrical conductivity, and excellent bending formability, and a method for producing the alloy. The copper alloy contains 1.2 to 2.5% by mass of cobalt (Co); 0.2 to 1.0% by mass of silicon (Si); 0.01 to 0.5% by mass of iron (Fe); 0.001 to 0.2% by mass of phosphorus (P); a balance amount of copper (Cu); unavoidable impurities; and optionally, 0.05% by mass or smaller of each of at least one selected from a group consisting of nickel (Ni), manganese (Mn) and magnesium (Mg), wherein a ratio between cobalt (Co) mass and silicon (Si) mass meets a relationship: 3.5&#x2264;Co/Si&#x2264;4.5, wherein a ratio between iron (Fe) mass and phosphorus (P) mass meets a relationship: 1.0&#x3c;Fe/P. A bimodal structure improves the bending formability while maintaining the electrical conductivity and strength.

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Ulsan, South Korea

Sidam Lee