Pac Tech Packaging Technologies G.m.b.h.

Smart Pac Gmbh Technology Services

Siavash Hosseinpour Tabrizi

Ghassem Azdasht

Elke Zakel

Thorsten Teutsch

Mohammad Hossein Azhdast

An arrangement () for the reproducible application of small amounts of liquid onto a target surface, comprising a liquid reservoir () with an opening () which can be positioned above the target surface, a plunger () which is arranged so as to be movable in an opening direction, and a drive () for moving the plunger, is distinguished by the fact that the opening () is formed in a projecting, tapering tip or nozzle (), and the plunger () extends all the way through the liquid () situated in the liquid reservoir () and into the tip or nozzle (), such that during a plunger movement in an opening direction, liquid portions in the opening region are moved outward through the opening by the plunger.

Arrangement and method for the reproducible application of small amounts of liquid

A diode arrangement includes a diode and two electrodes. Each electrode is connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces of the diode. The contact surfaces of the diode are formed substantially by the surfaces of a lower side and an upper side of the diode and are contacted with the contact extensions of the electrodes via the soldered connection. The contact extensions forming counter contact surfaces are substantially congruent with the contact surfaces of the diode.

Diode array and method for producing a diode array

The present invention relates to a transfer device () for receiving and transferring a solder ball arrangement (). Said transfer device comprises a discharge container () and a transfer substrate () that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall () and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device () for subjecting said discharge container to ultrasound vibrations.

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Berlin, Germany

Siavash Hosseinpour Tabrizi