3m Innovative Properties Company

Siang Sin Foo

Ravi Palaniswamy

Justine A Mooney

Andrew John Ouderkirk

Arokiaraj Jesudoss

Fong Liang Tan

Alejandro Aldrin Il Agcaoili Narag

Hiromitsu Kosugi

Alejandro Aldrin A Narag, Ii

Alejandro Aldrin Ii Agcaoili Narag

Douglas B Gundel

Michael Alan Meis

John D Geissinger

James F Poch

Mahmut Aksit

Brinda B Badri

Jae Yong Lee

Brent D Lunceford

Antonny Enojo Flor

Sung Won Moon

Phillip J Bergeron

Choong Meng How

Wei Meng Pee

Donato G Caraig

Alejandro Aldrin A Narag Ii

Antonny E Flor

A direct to chip cooling film for two-phase cooling. The film includes a dielectric layer having a first surface for attachment to a cold plate or circuits and having a second surface. A metal layer is on the second surface of the dielectric layer with a pattern of features on a side opposite the dielectric layer. This surface pattern provides increased surface area and multiple nucleation sites for bubbles formation for two-phase cooling. The features can also include metal nodules to further enhance the nucleation.

Patterned design for thermal management of two-phase immersion cooling system for electronics

Systems and methods for monitoring the status of air filters are provided. One or more thermoelectric sensors are provided to have an upstream sensing surface positioned adjacent the inlet surface of the air filter, and a downstream sensing surface positioned adjacent the outlet surface of the air filter. Sensing circuitry are connected to the thermoelectric sensors, configured to receive signals from the thermoelectric sensors and process the signals to obtain status information of the air filter.

Air filtration monitoring based on thermoelectric devices

A flexible multilayer construction () for mounting a light emitting semiconductor device () (LESD), includes a flexible dielectric substrate () having an LESD mounting region (), first and second electrically conductive pads () disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD () received in the LESD mounting region, and a first fiducial alignment mark () for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.

Fiducial mark for chip bonding

Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

Flexible LED assembly with UV protection

Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.

Flexible printed circuit and a method of fabricating a flexible printed circuit

A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.

MEMS devices on flexible substrate

Flexible LED assemblies () are described. More particularly, flexible LED () assemblies having flexible substrates () with conductive features () positioned on or in the substrate, and layers of ceramic () positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semi-conductor device to the conductive layer.

Flexible light emitting semiconductor device

An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.

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Singapore, Singapore

Siang Sin Foo