Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Intellectual Discovery Co., Ltd.

Siang Ling Oon

Chin Nyap Tan

Kee Yean Ng

Kean Loo Keh

Thye Linn Mok

Lig Yi Yong

Kha Yan Loon

Boon Kheng Lee

Boon Keat Tan

Kum Soon Wong

Chu Kun Tan

Ju Chin Poh

Bit Tie Chan

An electronic assembly includes a Light Emitting Diode (LED) and a substrate. The LED has a solderable surface other than the contacts. The substrate has an opening. The solderable surface is mounted substantially over the opening. When the opening is filled with solder, the solderable surface is metallically bonded with the solder in the opening.

Light emitting diode device

Light sources are disclosed herein. One embodiment comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer. The substrate may be thinner in the area where the light emitter is affixed than in the areas where the first and second electrically conductive layers are affixed. A heat sink may be attached to the second surface of the substrate.

Light source

A light source is described herein. An embodiment of the light source comprises a mounting surface and a first lead frame. The first lead frame extends from the mounting surface. The first lead frame comprises a first portion extending from the mounting surface; a cup portion having a cup portion first side and a cup portion second side, the cup portion first side configured to receive a light-emitting diode, the cup portion second side being located opposite the cup portion first side; and a second portion extending between the first portion and the cup portion second side.

Light source using a light-emitting diode

Light sources are disclosed herein. An embodiment of a light sources comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer.

A system and method for lighting structure designs, for example LED packaging, reflector designs and optics in lighting fixture, has been illustrated. In one embodiment, the lighting structure has multiple reflective surfaces such that a first reflective surface and a second surface form a first angle less than 90 degree while the second surface and a third reflective surface forms a second angle of less than 270 degree. The method can be applied in both LEDs package designs and second level optical application designs of a light module.

Lighting structure with multiple reflective surfaces

A light emitting device comprising a ceramic substrate is disclosed. And embodiment of the substrate comprises a mounting portion, a peripheral wall extending from the mounting portion, and a reflective surface extending from the peripheral wall opposite the mounting portion. The reflective surface has a reflective material located thereon. The peripheral wall, the mounting portion, and the reflective surface form a well. A light emitter is located adjacent the mounting portion. A transparent material is located in the well. The peripheral wall is devoid of the reflective material.

Ceramic light emitting device package

A light emitting device is disclosed herein which includes a substrate, a housing, a light emitting die, and a cup with a reflective inner surface. The housing has an upper surface and at least one sidewall and is mounted on the upper surface of the substrate, thereby forming a cavity. The light emitting die is mounted on the upper surface of the substrate within the cavity. The cup is positioned within the cavity and is supported by the housing. The cup has a continuous sidewall with a reflective inner surface surrounding the light emitting die and a lowermost edge that is suspended above, detached and spaced away from the upper surface of the substrate.

Light emitting device

A light-emitting device having an anode and a cathode is disclosed herein. An embodiment of the light-emitting device comprises a first lead connected to the anode of the light-emitting device and a second lead connected to the cathode of the light-emitting device. The first lead has a first bend, wherein the direction of the first bend indicates that the first lead is connected to the anode. The second lead has a second bend, wherein the direction of the second bend indicates that the second lead is connected to the cathode.

Light-emitting device

Light emitting diode

A light source and a method for making the same are disclosed. The light source includes a lead frame, an integrated circuit chip and a body. The lead frame has first and second sections. The first section includes a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is bonded to the first section in the chip mounting area and is in thermal contact with the chip mounting area. The body has top, bottom, and side surfaces. The first extension is bent to provide a heat path from the chip mounting area to the side surface, a surface of the first extension that is not in contact with the side surface forming a first planar bonding surface. The heat path has less thermal resistance than a heat path through the lateral portion.

Growing community of inventors

Penang, Malaysia

Siang Ling Oon