Micron Technology Incorporated

Texas Instruments Corporation

Sian Yong Khoo

Teck Kheng Lee

Kian Chai Lee

Thiam Chye Lim

Victor Cher Khng Tan

Yong Kian Tan

Kwang Hong Tan

Chong Pei Andrew Lim

Yoke Kuin Tang

Kay Kit Tan

Kian Teng Eng

Chee Kiang Yew

Bok Leng Ser

An apparatus and method for improving the yield and reducing the cost of forming a semiconductor device assembly. An interposer substrate is formed with interconnections in the form of conductive bumps on both a first surface and a second surface to provide a respective first level interconnect and a second level interconnect for a semiconductor die to be mounted to the interposer substrate. The conductive bumps and conductive elements may be formed simultaneously by a plating process. The conductive bumps on the first surface are arranged to correspond with bond pads of a semiconductor die for the first level interconnect. The conductive bumps on the second surface are configured to correspond with a terminal pad pattern of a carrier substrate or other higher-level packaging.

Double bumping of flexible substrate for first and second level interconnects

Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.

BOC BGA package for die with I-shaped bond pad layout

A high density single inline memory module (140) comprising a printed circuit board (132) and at least one integrated circuit module (130) attached to the first side (134) of the printed circuit board (132), wherein the integrated circuit modules (130) each including first and second integrated circuit packages (30) stackably and electrically connected together is disclosed.

High density single inline memory module

Growing community of inventors

Singapore, Singapore

Sian Yong Khoo