Lg Chem, Ltd

Si Yeon Baek

Seung Min Lee

Se Woo Yang

So Young Kim

Min Soo Park

The present application relates to a photo-curable resin composition and a use of the same. The present application can provide a photo-curable resin composition having not only excellent various physical properties such as heat resistance, adhesive force and cohesive force but also an elastic modulus after pre-curing which is suitable for a Dam & Fill process. The photo-curable resin composition may be useful for direct bonding between optical members or as a filling agent of an air gap.

Photo-curable resin composition and use of the same

The present application relates to a curable composition and a use thereof. The present application can provide a curable composition having excellent physical properties such as adhesive durability as well as maintaining transparency even in a high-temperature and high-humidity environment. Such a curable composition can be usefully used for direct bonding between a filler and an optical member of a display device.

Curable composition

The present application relates to a curable composition and a use thereof. The present application can provide a curable composition having excellent transparency, heat resistance and adhesion. Such a curable composition can be usefully used in direct bonding between a filler and an optical member of a display device.

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Daejeon, South Korea

Si Yeon Baek