Samsung Electronics Co., Ltd.

Si-Hoon Lee

Donghan Kim

Un-Byoung Kang

Tae-Gyu Kim

Sa-Yoon Kang

Ye-Chung Chung

Suk-Chae Kang

Gu-Sung Kim

Eun-Seok Song

Tae-Pyeong Kim

Yun-hyeok Im

Jae-ho Baek

Farah Alnaimi

Jeong-Su Han

Jong-Soo Hong

A method for measuring an odor in an olfactory sensing device is provided. The method includes sensing an odor using at least one odor sensor, estimating a current temperature using a temperature count coefficient of a monitor sensor, calculating an odor count coefficient variation for the at least one sensor, and measuring the odor by applying a temperature count coefficient variation corresponding to a temperature change to the odor count coefficient variation.

Olfactory sensing device and method for measuring odor

Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size.

Pad arrangement of driver IC chip for LCD and related circuit pattern structure of tab package

A semiconductor device comprises at the wafer level one or more ferrite structures adapted to dampen high frequency noise potentially apparent at signal lines and termination points within the semiconductor device. Related methods of forming said ferrite structures are also disclosed.

Semiconductor package with ferrite shielding structure

Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package

A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.

Semiconductor package

A semiconductor package includes a metal plate in which one or more openings are formed, the metal plate mounting a semiconductor chip and a printed wire pattern substrate, e.g. a PCB, mounting one or more decoupling capacitors. The semiconductor chip is in direct contact with the metal plate to improve thermal characteristics, and the substrate is supported by the metal plate to increase mechanical stability of the package. The one or more openings in the metal plate accommodate the passing therethrough of plural pins electrically connected via the printed wire pattern substrate to the semiconductor chip. The semiconductor package can be usefully applied to a digital micro-mirror device (DMD) semiconductor package for use in a projection display device.

Semiconductor package and method for its manufacture

A tape circuit substrate comprises a base film made of an insulating material, and a wiring pattern layer which is formed on the base film and has first leads that are connected to electrode pads arranged near a periphery of a semiconductor chip and second leads that are connected to electrode pads arranged near the center of the semiconductor chip. The semiconductor chip package comprises a semiconductor chip electrically bonded to the tape circuit substrate through chip bumps. In such a case, each of the leads is configured such that a tip end thereof to be bonded to the electrode pad has a width larger than that of a body portion thereof. According to the present invention, since the interval between the lead and the electrode pad can be made even narrower, a fine pitch semiconductor device can be realized.

Tape circuit substrate and semicondutor chip package using the same

A film carrier tape and a method of forming a film carrier tape that incorporates a polymeric reinforcement film are provided for decreasing the deformation of and damage to film carrier tapes by forces resulting from contact with sprocket teeth during the semiconductor assembly process. The reinforcement film may include one or more synthetic resins and may increase the useable area of a base film used in forming film carrier tapes.

Growing community of inventors

Gyeonggi-do, South Korea

Si-Hoon Lee