Samsung Electronics Co., Ltd.

Si-hoon Lee

Sa-Yoon Kang

Kyoung-sei Choi

Sang-Ho Park

Eun-Seok Song

Byung-seo Kim

Ye-chung Chung

Kyong-Soon Cho

Young-sang Cho

Sang-Gui Jo

Dae-woo Son

Sang-Heui Lee

Young-jae Joo

Jeong-kyu Ha

Jeong-ho Park

Tae-gyu Kim

Tae-Pyeong Kim

Min-chul Lee

Jeong-su Han

Jae-ho Baek

Farah Alnaimi

Kwang-min Park

Jong-soo Hong

Jae-cheon Doh

A gas sensing system includes a driving circuit chip, and a gas sensor, a temperature sensor, and a humidity sensor, which are located on the driving circuit chip. The gas sensing system compensates a gas sensing result based on at least one of a temperature sensing result and a humidity sensing result and generates a gas sensing signal. The gas sensor includes a first resonator and a first sensing film being configured to sense a first gas and located on the first resonator to be exposed to the outside. The temperature sensor includes a second resonator and an encapsulation layer located above the second resonator not to expose the second resonator to the outside, and the humidity sensor includes a third resonator.

Gas sensing device, electronic device including the gas sensing device, and gas sensing system

A formaldehyde detecting apparatus includes a formaldehyde sensor configured to measure concentration of formaldehyde in air; a printed circuit board on which the formaldehyde sensor is disposed, the printed circuit board including a signal processor configured to process a signal output from the formaldehyde sensor; a fixing member disposed on the printed circuit board, the fixing member configured to fix the formaldehyde sensor, wherein the fixing member prevents the formaldehyde sensor from oscillating with respect to the printed circuit board by external vibration; and a power supply configured to supply a voltage capable of stabilizing an output signal to the signal processor.

Formaldehyde detecting apparatus, and air treatment apparatus having the same

A cover device including: a rear cover; a front cover rotatable with respect to the rear cover; and an odor detection module mounted to the front cover. The cover device enables miniaturization of an odor detector and ensures portability of an electronic device even through the odor detector is connected to the electronic device, and enhances the outward appearances of the electronic device, and an electronic device having the cover device.

Cover device with odor detector and electronic device having the same

A Chip on Flexible Printed Circuit (COF) type semiconductor package may include a flexible film, a semiconductor IC chip on the flexible film, and a heating pad on the flexible film.

Chip on flexible printed circuit type semiconductor package

Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within the chip mount portion toward a second side. The second wiring extends into the chip mount portion through a third side and bends within the chip mount portion toward the second side. The first, second, and third sides are different sides of the chip mount portion. Thus, size and in turn cost of the base film are minimized by arranging wirings within the chip mount portion for further miniaturization of electronic devices, such as a display panel assembly, using the tape circuit substrate.

Tape circuit substrate with reduced size of base film

A chip-on-film package may include a tape wiring substrate, a semiconductor chip mounted on the tape wiring substrate, and a molding compound provided between the semiconductor chip and the tape wiring substrate. The tape wiring substrate may include a film having upper and lower surfaces. Vias may penetrate the film. An upper metal layer may be provided on the upper surface of the film and include input terminal patterns and/or output terminal patterns. The input terminal patterns may include ground terminal patterns and/or power terminal patterns. A lower metal layer may be provided on the lower surface of the film and include a ground layer and/or a power layer. The ground layer and the power layer may cover at least a chip mounting area.

Tape wiring substrate and chip-on-film package using the same

Semiconductor package films and a display module comprising a packaged semiconductor device punched from a semiconductor package film are provided. In one embodiment, the invention provides a semiconductor package film comprising a base film comprising a plurality of semiconductor device regions, an intermediate region disposed on a first surface of the base film and disposed between two semiconductor device regions, and a reinforcing member attached to a second surface of the base film opposite the first surface of the base film and attached opposite the intermediate region. Each semiconductor device region comprises a semiconductor mounting region adapted to receive a semiconductor chip, and first and second metal line regions.

Semiconductor package film having reinforcing member and related display module

Growing community of inventors

Yongin-si, South Korea

Si-hoon Lee