Avary Holding (shenzhen) Co., Limited.

Hongqisheng Precision Electronics (qinhuangdao) Co., Ltd.

Qing Ding Precision Electronics (huaian) Co., Ltd

Hong Heng Sheng Electronical Technology (huaian) Co., Ltd.

Si-Hong He

Ning Hou

Mei-Hua Huang

Biao Li

Zu-Ai Li

Jin-Cheng Wu

The present invention relates to a multi-sided light-emitting circuit board, which includes: a transparent substrate layer and a first conductive circuit layer on at least one surface of the transparent substrate layer. The first conductive circuit layer includes conductive portions arranged at intervals. A metal piece is formed on a surface of each conductive portion away from the transparent substrate layer. An accommodation space is formed between adjacent metal pieces. The accommodation space is provided with a light-emitting chip. Each light-emitting chip includes two electrodes. The two electrodes are respectively located at opposite ends of the light-emitting chip. The electrodes are respectively electrically connected to adjacent metal pieces. An encapsulant layer is formed on a surface of the first conductive circuit layer. The encapsulant layer covers and encapsulates the metal pieces and the light-emitting chips. The invention also relates to a method for manufacturing a multi-faceted light-emitting circuit board.

Multi-sided light-emitting circuit board and manufacturing method thereof

A circuit board with inbuilt heat dissipating structure includes a stacked structure and the heat dissipation structure. The stacked structure includes first and second copper layers and a cover plate. The embedded heat dissipation structure includes a base body, a thermally conductive adhesive, and a phase changing liquid. The base body penetrates the first copper layer and the first substrate layer, is connected to the second copper layer, and defines grooves. The grooves contain the phase changing liquid. The thermally conductive adhesive seals the ends of the grooves and the cover plate is located on a surface of the stacked structure and covers the thermally conductive adhesive. A method for manufacturing the circuit board is further disclosed.

Circuit board with heat dissipation structure and method for manufacturing same

A circuit board () includes an insulating base layer (), a first conductive circuit layer () disposed on the base layer (); a solder mask layer () covering the first conductive circuit layer () away from the base layer (), wherein the solder mask layer () defines a slot (), the slot () exposes a portion of the first conductive circuit layer (), the solder mask layer () includes a sidewall () at the slot (); and a cover film () covering the solder mask layer (), wherein the cover film () defines an opening (), the opening () corresponds to the slot () and exposes the solder pad (), the cover film () includes a covering portion () and a side reflecting portion (), the covering portion () is disposed on the solder mask layer (), the side reflecting portion () is connected to the covering portion () and covers the sidewall ().

Circuit board, method for manufacturing the same, and backlight

A circuit board film-plated against corrosion of conductive traces comprises a substrate, a conductive circuit layer attached to the substrate, a plating film attached to outer surface of the conductive circuit layer, and a covering film. Each plating film comprises a top outer surface and a side surface. The circuit board defines at least one through hole. Each through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surfaces, and the through holes. The conductive circuit layer and the side surfaces of the plating films are sealed against the atmosphere and cannot be corroded. A method for making the circuit board is also provided.

Method for making circuit board

A circuit board film-plated against corrosion of conductive traces comprises a substrate, at least one conductive circuit layer attached to the substrate, at least one plating film attached to a surface of the conductive circuit layer away from the substrate, and a covering film. Each of the at least one plating film comprises a surface away from the conductive circuit layer, and at least one side surface. The circuit board defines at least one through hole. Each of the at least one through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surface of the plating film, and the through hole. The film-covered conductive circuit layer and the film-covered side surface of the plating film cannot be corroded. A method for making the circuit board is also provided.

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Shenzhen, China

Si-Hong He