Asml Netherlands B.v.

Si-Han Zeng

Patrick Warnaar

Arie Jeffrey Den Boef

Alexander Straaijer

Yue-Lin Peng

Jen-Yu Fang

Ching-Yi Hung

Maurits Van Der Schaar

Grzegorz Grzela

Victor Emanuel Calado

Erik Johan Koop

A method of measuring a property of a substrate, the substrate having a plurality of targets formed thereon, the method comprising:

Method of measuring a property of a substrate, inspection apparatus, lithographic system and device manufacturing method

Disclosed are a method, computer program and associated apparatuses for measuring a parameter of a lithographic process. The method comprising the steps of: obtaining first measurements comprising measurements of structural asymmetry relating to a plurality of first structures, each of said plurality of measurements of structural asymmetry corresponding to a different measurement combination of measurement radiation and a value for at least a first parameter; obtaining a plurality of second measurements of target asymmetry relating to a plurality of targets, each of said plurality of measurements of target asymmetry corresponding to one of said different measurement combinations, determining a relationship function describing the relationship between said first measurements and said second measurements, for each of said measurement combinations; determining, from said relationship function, a corrected overlay value, said corrected overlay value being corrected for structural contribution due to structural asymmetry in at least said first structure.

Metrology method and apparatus, computer program and lithographic system

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Taipei, Taiwan

Si-Han Zeng