Fujitsu Corporation

Shyun-ichi Fukuyama

Yoshihiro Nakata

Hideki Harada

Yoshiyuki Ohkura

Joe Yamaguchi

Michiko Katayama

A material and a method for planarizing an uneven surface of a substrate, such as those used for making wiring boards and electronic devices and having broad patterns on their surfaces, are provided. The material is a polysilphenylenesiloxane or a copolymer of polysilphenylenesiloxane with an organosiloxane, and is applied to an uneven surface of a substrate, and then heated to be reflowed to thereby be formed into a planarized film or layer. The material allows a substrate containing wiring having a width of up to several hundred micrometers to be planarized.

Growing community of inventors

Kawasaki, Japan

Shyun-ichi Fukuyama