Chung Shan Institute of Science and Technology

Shyu-Mou Chen

Chung-Ta Kau

Sheau-Shi Tzuoo

Ming-Chun Huang

The present invention relates to a z-axial solid-state gyroscope. Its main configuration is manufactured with a conductive material and includes two sets of a proof mass and two driver bodies suspended between two plates by an elastic beam assembly. Both surfaces of the driver bodies and the proof masses respectively include a number of grooves respectively perpendicular to a first axis and a second axis. The surfaces of the driver bodies and the proof masses and the corresponding stripe electrodes of the plates thereof are respectively formed a driving capacitors and a sensing capacitors. The driving capacitor drives the proof masses to vibrate in the opposite direction along the first axis. If a z-axial angular velocity input, a Coriolis force makes the two masses vibrate in the opposite direction along the second axis. If a first axial acceleration input, a specific force makes the two masses move in the same direction along the first axis. If a second axial acceleration input, a specific force makes the two masses move in the same direction along the second axis. Both inertial forces make the sensing capacitances change. One z-axial solid-state gyroscopes and two in-plane axial gyroscopes can be designed on a single chip to form a complete three-axis inertial measurement unit.

Solid-state gyroscopes and planar three-axis inertial measurement unit

Planar 3-axis inertial measurement unit

A multi-axis solid state accelerometer is made of electricity conductive material and is made by way of micro-machining. The main structure includes at least one proof mass connected to an anchor by several sensing beams and two boards are located on two sides of the main structure and fixed to the anchor. The sensing beams make the proof mass movable in parallel to or perpendicular to the boards. The surfaces of the proof mass include several grooves, which are parallel to the first axis and the second axis, and an area that has no grooves. Each board that face the grooves include two sets of electrodes and each of which includes several elongate electrodes located corresponding to the grooves. The two sets of elongate electrodes are located interposed each other. The board facing the area having no grooves has electrodes. The electrodes and the surfaces of the proof mass form detection capacitors for each axis. The component of the acceleration on each axis drives the proof mass to move along the respective axis and the capacitances of the corresponding capacitors are changed.

Multi-axis solid state accelerometer

A silicon dual inertial sensor made of a () silicon chip comprises at least a proof-mass, which is connected to a corresponding inner frame with a plurality of sensing resilient beams to make it easier for the proof-mass to move perpendicular to the surface of the silicon chip (defined as z-axis), and each inner frame is connected to an outer frame with a plurality of driving resilient beams, or connected to common connection beams, which are then connected to a central anchor with common resilient supporting beams to make it easier for the inner frame to move in parallel with the surface of the silicon chip (defined as y-axis). Each inner frame is driven by a driver to move in an opposite direction along the y-axis, and also move the proof-mass in the opposite direction along the y-axis. If there is a rotation rate input along the x-axis, it will generate a Coriolis force to make each proof-mass move in the opposite direction of the z-axis. If an acceleration is input along the z-axis, the specific force will move the proof-masses with the same direction. When the proof-masses move or oscillate, the capacitance of the capacitor formed with sensing electrodes will change due to the change of the distance. The moving distance can be obtained by measuring the change of the capacitance. Because the rotation rate outputs an alternating signal, and the acceleration outputs a direct signal, they can be separated with signal processing. The deep vertical etching characteristics of the () silicon chip is utilized to make the driving beam in order to control the driving resonance frequency more precisely, and improve the yield rate and the performance of the gyroscope.

Growing community of inventors

Longtan, Taiwan

Shyu-Mou Chen