United Microelectronics Corp.

Shyan-Yhu Wang

Jung-Ching Chen

Kun-Lin Wu

Shang-Chi Wu

Yuh-Turng Liu

Ching-Ho Yang

Shu-Chun Chan

A semiconductor device including a plurality of doped regions, a metal layer and a polysilicon layer is provided. The doped regions are disposed in a substrate. The metal layer includes a plurality of metal line patterns. The polysilicon layer disposed between the substrate and the metal layer includes a gate pattern and at least one guard ring pattern. The at least one guard ring pattern connects to the gate pattern and surrounds at least one of the metal line patterns. One of the metal line patterns connects to the gate pattern. The others of the metal line patterns connect to one of the doped regions in the substrate.

Semiconductor device

A semiconductor device is provided. An isolation structure is formed in a substrate to define a first and a second active region, and a channel active region therebetween. A field implant region is formed below a portion of the isolation structure around the first, second, and channel active regions. A channel active region includes two first sides defining a channel width. The distance from each first side to a second side of a neighboring field implant region is d. The shortest distance from a third side of each first or second active region to an extension line of each second side of the field implant region is d. R=d/d, where 0.15&#x2266;R&#x2266;0.85. A gate structure covers the channel active region and extends over a portion of the isolation structure. Source/drain doped regions are formed in the first and the second active regions.

A method of manufacturing gate oxide layers with different thicknesses is disclosed. The method includes that a substrate is provided first. The substrate has a high voltage device region and a low voltage device region. Then, a high voltage gate oxide layer is formed on the substrate. Afterwards, a first wet etching process is performed to remove a portion of the high voltage gate oxide layer in the low voltage device region. Then, a second wet etching process is performed to remove the remaining high voltage gate oxide layer in the low voltage device region. The etching rate of the second wet etching process is smaller than that of the first wet etching process. Next, a low voltage gate oxide layer is formed on the substrate in the low voltage device region.

Method for manufacturing gate oxide layer with different thicknesses

Performance of the high resistance resistor, which is polysilicon, is improved by treating the surface of the polysilicon layer in mixed signal integrated circuits for ADSL (Asymmetric Digital Subscriber Line) broadband service application. This treated surface of the polysilicon layer will prevent ions in the resistor from out-diffusion when performing an annealing step after forming the resistor.

Growing community of inventors

Hsinchu County, Taiwan

Shyan-Yhu Wang