Tsinghua University

Shwin-Chung Wong

Chin-Fu Chen

Wei-Yuan Hsu

Suh-Yun Feng

Yung Feng Chang

A vapor chamber device adapted to be thermally coupled to a heat source includes a first casing and a second casing. The first casing includes a first plate, a first capillary structure at an inner surface of the first plate, and a first lateral wall protruding from the inner surface and surrounding the first capillary structure. The heat source is adapted to contact an outer surface of the first plate. The second casing is stacked on the first casing and includes a second plate, a plurality of supporting posts protruding from the second plate, and a second lateral wall protruding from the second plate and surrounding the supporting posts. The supporting posts face towards the first capillary structure, and the first lateral wall is connected to the second lateral wall. The vapor chamber device includes a second capillary structure disposed between the first capillary structure and the supporting posts, and a third capillary structure disposed in an area which is at the inner surface of the first plate and corresponds to the heat source.

Vapor chamber device

A heat dissipation device includes a base, fins and strip-shaped plates. The fins protrude side by side from the base, and the fins respectively include first end edges and second end edges opposite to each other. The first end edges are connected to the base. The strip-shaped plates are parallel to the base and connected to at least a part of the second end edges of the fins, and strip-shaped openings are formed between the strip-shaped plates. The base, the fins and the strip-shaped plates collectively surround chambers in a non-closed manner, and each of the strip-shaped openings is connected to the corresponding chamber. A distance between two adjacent fins of the fins is S, a width of any one of the strip-shaped openings is d, and d/S is between 0.01 and 0.4.

Heat dissipation device

The present invention relates to a rapidly removable thermal connector including a retainer and a clamper. The retainer has a first wedge connected with a convexity of a first two-convexity tenon and a second wedge. At the outer end of the first wedge has a mortise to allocate a convexity of the first two-convexity tenon; at the inner end of the second wedge has a mortise to allocate a convexity of a second two-convexity tenon. The clamper is used to hold the retainer. At the interior of the outer end of the clamper has a movable unit which is connected to the clamper with a bolt at one end and has a vertical concavity at the other end to match the first convexity of the first two-convexity tenon. At the interior of the inner end of the clamper has a mortise which allocates the fourth convexity of the second two-convexity tenon. The third convexity of the second two-convexity tenon is connected to a mortise at the inner end of the second wedge.

Quick detachable thermal connector

A liquid cooling method for cooling LED lights used for minimally invasive surgeries is provided. The LED lights are integrated with the micro camera so that only one pipeline is needed to accommodate the electrical wires and cooling liquid conduits. The electrical wires disposed in the electrical wire conduit provide the path for electrical power required by the micro camera and the LED lights as well as the electronic signals from the micro camera. The liquid conduits guide the circulating cooling liquid to pass by the bottom surface of the LED substrate and carry the generated heat off the human body.

Cooling of integrated LED lights and micro camera for minimally invasive surgeries

Heat dissipation devices for an LED lamp set has a plate-type heat spreader as the core unit. The plate-type heat spreader is either a flat-plate heat pipe or a metal plate embedded with heat pipes. The high-power LED lamps are thermally connected to the bottom surface of the heat spreader so that the heat generated by the LED lamps is absorbed by the evaporation region of the flat-plate heat pipe or the embedding heat pipes. The heat is spread by internal vapor motion of the working fluid toward different regions of the heat spreader. The top surface of the heat spreader is connected with a finned heat sink, where the heat is delivered to the ambient air. The hot air leaves by buoyancy through the openings on a lamp housing located above the finned heat sink. The inner surface of the lamp housing can be connected with the top surface of the plate-type heat spreader, with the heat dissipated out at the surface of the housing by natural convection.

Heat dissipation devices for an LED lamp set

Heat from a heat generating device such as a CPU is dissipated by a heat spreader containing a cycled two-phase vaporizable coolant. The coolant cycles inside a closed metal chamber, which has an upper section and a lower section. The lower section contains a wick layer, a part or parts of which serves as an evaporator. The upper section is composed of a set of channels. The channel walls contain a plurality of cut-off openings over the evaporator region to allow for vapor distribution efficiently. The liquid coolant in the evaporator is vaporized by the heat from the heat generating device. The coolant vapor can prevail in the channels by either directly entering the adjacent channels or indirectly through lateral conduits formed with the wall openings. The vapor condenses on the channel, walls to liberate latent heat which is then dissipated out through the top chamber wall. The condensed coolant is directly collected by the lower-section wick and further flows back to the wick evaporator by capillary action, thereby cycling the coolant.

Flat-plate heat pipe containing channels

Heat from a heat generating device such as a CPU is dissipated by a heat sink device containing a recycled two-phase vaporizable coolant. The coolant recycles inside a closed metal chamber, which has an upper section and a lower section connected by a conveying conduit, and a wick evaporator placed in the lower section. The liquid coolant in the evaporator is vaporized by the heat from the heat generating device. The coolant vapor enters the upper section and condenses therein, with the liberated latent heat dissipated out through the inner top chamber wall. The condensed coolant is then collected and flows into the lower section, and further flows back to the wick evaporator by capillary action of the evaporator, thereby recycling the coolant. Space or a piece of element with parallel grooves is used to form at least one of the sections to reduce friction in the liquid flow path.

Microchannel flat-plate heat pipe with parallel grooves for recycling coolant

Heat from a heat generating device such as CPU is dissipated by a heat sink device containing a recycled two-phase vaporizable coolant. The coolant recycles inside a closed metal chamber, which has an upper section and a lower section connected by a conveying conduit, and a wick evaporator placed in connection with the lower section. The liquid coolant in the evaporator is vaporized by the heat from the heat generating device. The coolant vapor enters the upper section and condenses therein, with the liberated latent heat dissipated out through the inner top chamber wall. The condensed coolant is then collected and flows into the lower section, and further flows back to the wick evaporator by capillary action of the evaporator, thereby recycling the coolant. Space or a piece of element with parallel grooves is used to at least one of the sections to reduce friction in the liquid flow path.

Growing community of inventors

Hsinchu, Taiwan

Shwin-Chung Wong