Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Shuzo Yagi

Takeyuki Kawase

Yoshiyuki Kitagawa

Takashi Tamura

Hiroki Yamamoto

Toru Ikeda

Kazuhiro Kishikawa

Masao Nakane

Hiroki Kobayashi

Yoshinori Isobata

Chikara Takata

Nobuhiro Nakai

Yoshiaki Awata

Yasuo Takanami

Tetsushi Oohori

Naoto Kohketsu

Noboru Furuta

A component mounting system includes a component mounter that mounts a component in a board, a tape feeder (component feeder) that is placed in the component mounter and supplies the component, and a mobile component supply device that holds a tape cassette (container) storing a component, automatically moves, and supplies the component in the tape cassette (container) to the tape feeder (component feeder).

Component mounting system

In an electronic component mounting systemconfigured by coupling electronic component mounting devices Mto MA each having a first substrate transport mechanismA and a second substrate transport mechanismB together, the electronic component mounting device MA includes a first tray feederA that stores an electronic component extracted by a first mounting headA of a component mounting mechanism as a first work operation mechanism, and a second tray feederB that stores an electronic component extracted by a second mounting headB of a component mounting mechanism as a second work operation mechanism.

Electronic component mounting system and electronic component mounting method

In a component mounting device () which has a first mounting lane (L) and a second mounting lane (L) and which is structured so as to be able to select either an independence mounting mode or an alternation mounting mode, when device type changing operation is performed with change of the type of boards which are the mounted objects, if a tape feeder float detecting sensor () that is provided in proximity of an opening () through which a part of the body or the foreign object enters in the component supplying part is, detects a part of the body such as a finger () of the operator or the foreign object, operation of the component mounting mechanism which belong to the mounting lane opposite to the mounting lane to which the component supplying part, in which the optical sensor is provided, belongs is stopped.

Component mounting device and component mounting method

In a component mounting device () which includes a first mounting lane (L) and a second mounting lane (L) and for which an independence mounting mode and an alternation mounting mode are selectable, a first limited movable area (RA) and a first limited movable area (RB) in which the movements in the horizontal direction of a first mounting head (A) and a second mounting head (B) of the mounting lanes are permitted in the independence mounting mode, are set as areas different from second limited movable areas in the alternation mounting mode, to prevent the mounting head of the mounting lane which is continuously operating from entering into the area of the mounting lanes for which the device type changing operation is being performed.

When performing the device type changing operation with the change of the board type to undergo mounting, the component mounting device, which has a first mounting lane and a second mounting lane and which is structured so as to be able to select either an independent mounting mode or an alternate mounting mode, moves a mounting head of the mounting lane to and thereafter positions and fixes to a previously-set predetermined withdraw position [P] where entry of a portion of a body of an operator by way of an opening () formed in a protective cover () can be prevented and where safety of the operator is not impaired even if a mounting head of a mounting lane on the other side has undergone collision.

In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus.

Electronic component mounting method providing a substrate standby area

An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (A,B) positioned lateral to conveyor lines including conveyors (A,B,C,D) arranged in parallel; and a substrate distributing unit (MB) configured to distribute substrates () delivered from an upstream apparatus, in the case where a substrate request signal (R) is output for a plurality of conveyors, a new substrate () is carried in from the substrate distributing unit (MB) into conveyors (A,D) which are closest to the component supplying units (A,B) among the conveyors (A,B,C,D). Therefore, substrates can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.

Component mounting apparatus and substrate conveyance method in component mounting apparatus

An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (A,B) positioned lateral to conveyor lines including conveyors (A,B,C,D) arranged in parallel; and a substrate distributing unit (MB) configured to distribute substrates () delivered from an upstream apparatus, in the case where a substrate request signal (R) is output from conveyors (B,C) which are farther from the component supplying units (A,B), when the substrate request signal R is output for a conveyor (D) which is closer to the component supplying unit () prior to start of a transferring work of the new substrate (), the new substrate () is carried into the conveyor (D). Therefore, a substrate can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.

A substrate conveyor track is provided with first to fourth conveyors. Two conveyors situated on both sides of the substrate conveyor track, and the other two conveyors situated at the center of the same. There is enabled selection of any one from a small substrate mounting mode for giving a single substrate conveyance width to the four conveyors and mounting electronic components on four small substrates having the single width; a large substrate mounting mode for actuating all movable conveyors to the center of the substrate conveyor track and mounting electronic components on two large substrates by the two conveyors; and a large-small-substrates mounting mode for bringing the two conveyors on one side of the substrate conveyor track, among the four conveyors, into the small substrate mounting mode and bringing one of the conveyors on the other side of the track into the large substrate mounting mode.

Electronic component mounting device

An object is to provide a substrate conveyance apparatus and a substrate detection device capable of improving flexibility in arrangement layout. The substrate detection device includes a projectorfor projecting inspection lightso as to pass through a predetermined position on a path of a substrateconveyed by conveyance belts, a light receiverfor receiving the inspection lightprojected by the projector, and a detector (a control device) for detecting that the substratereaches the predetermined position based on a decrease in the amount of received light of the inspection lightreceived by the light receiverwhen the substrateconveyed by the conveyance beltsreaches the predetermined position and a portion of the inspection lightis blocked by the substrate. The inspection lightis projected from the projectorso as to include opposite ends of a width direction of the conveyance beltsin an optical path of the inspection light in a direction orthogonal to a conveyance direction of the substrateconveyed by the conveyance beltsand the light receiverreceives the inspection light passing through upper and lower regions of the conveyance beltsin the width direction.

Growing community of inventors

Yamanashi, Japan

Shuzo Yagi