Mitsubishi Shindoh Co., Ltd.

Shuzo Umezu

Takeshi Suzuki

Tadao Sakakibara

Yoshio Abe

Masahiko Ishida

Jun-Ichi Kumagai

Akira Saito

Ryo Iino

Akihito Mori

A Cu&#x2014;Ni&#x2014;Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni&#x2014;Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm, and the number of the Ni&#x2014;Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm, a/b is in a range of 0.5 to 1.5.

Cu&#x2014;Ni&#x2014;Si-based copper alloy sheet having excellent mold abrasion resistance and shear workability and method for manufacturing same

A plated material reduces insertion and withdrawal forces when used in a connector. A terminal member for a connector and a connector therewith are also provided. The plated material comprises a substratemade of Cu or a Cu alloy and a metal plating layerformed on the surface of the substrate. A soft regionA spreading in a network-shape and a hard regionB surrounded by the network of the soft regionA coexists in the metal plating layer. The soft regionA has a Vickers hardness of 20 to 250, while the hard regionB has a Vickers hardness of 60 to 700, which is at least 30 higher than that of the soft regionA. An average size of the network of the soft regionA is from 5 to 500 &#x3bc;m.

Plated material and method of manufacturing the same, terminal member for connector, and connector

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Aizuwakamatsu, Japan

Shuzo Umezu