Fujitsu Corporation

Shuzo Igarashi

Yasushi Kobayashi

Yasuhiro Teshima

Yutaka Higashiguchi

Yasuhiro Ichihara

Toshio Kumai

Mamoru Niishiro

Yukio Sekiya

Mitsuo Inagaki

Ryoichi Ochiai

Hiroshi Iimura

Masatomo Maida

Hideaki Tamura

Seishi Chiba

A characteristic amount calculating device for soldering inspection. The characteristic amount calculating device includes a design information inputting section for inputting design information of an inspection object, an inspection standard inputting section for inputting an inspection standard, a solder shape calculating section for calculating shape information of a solder fillet according to the design information, and an inspection image calculating section for calculating an inspection image according to the shape information. The characteristic amount calculating device further includes a characteristic amount calculating section for calculating a characteristic amount from the inspection image, a solder shape defective/nondefective determinating section for determining whether the solder shape is defective or nondefective from the shape information by using the inspection standard, and a characteristic amount outputting section for displaying or outputting the characteristic amount and a result of defective/nondefective determination.

Characteristic amount calculating device for soldering inspection

A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.

Semiconductor device having a bump which is inspected from outside and a

A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.

Semiconductor device and semiconductor device mounting board

Growing community of inventors

Kawasaki, Japan

Shuzo Igarashi