Shinko Electric Industries Co., Ltd.

Shuzo Aoki

Yoichi Harayama

Keiichi Takemoto

Takahiko Suzuki

Sumio Uehara

Tadayoshi Yoshikawa

Yoji Asahi

Miki Saito

Meisou Chin

Hisateru Iijima

Katsuaki Sakai

A substrate fixing device includes a base plate including therein a gas supply section, and an electrostatic chuck provided on the base plate. The electrostatic chuck includes a base having a mounting surface on which a target to be held by electrostatic attraction is mounted, an insertion hole, penetrating the base, having an inner surface that defines the insertion hole and is threaded to form a female thread, and a screw member, having an outer surface that is threaded to form a male thread, and inserted into the insertion hole to assume a mated state in which the male thread mates with the female thread. A gas from the gas supply section is supplied to the mounting surface via the screw member.

Substrate fixing device

A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and the electrostatic chuck are directly bonded to each other.

Substrate holding apparatus

A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devices, and heat radiating plates are mounted thereto by covering outer faces of the semiconductor devices over two pieces or more of the semiconductor devices, wherein the heat conducting sheet having a heat conductivity higher than a heat conductivity of the heat conducting sheet used for the semiconductor device having a heat generating amount smaller than a heat generating amount of the semiconductor device is used for the semiconductor device having a large heat generating amount in the semiconductor devices.

Semiconductor module and heat radiating plate

A semiconductor modulein which respective upper surfaces of semiconductor elementson both sides of a rectangular circuit boardare covered with radiator platesattached to both sides of the circuit boardso that their outer peripheral edges are not projected from the board surfaces of the circuit board. In this semiconductor module, by projections serving as a pair of attachmentsformed in the vicinity of the center area in a longitudinal direction of the circuit board, the radiator platesare located at predetermined positions. The projections abuts on the corresponding board surface of the circuit boardso that a part of the load applied to the vicinity of the center area of each the radiator platescan be supported by the circuit board

Semiconductor module and radiator plate

Growing community of inventors

Nagano, Japan

Shuzo Aoki